https://scholars.lib.ntu.edu.tw/handle/123456789/576879
標題: | Effects of Isothermal Heat Treatment on Microstructure Evolution of Microfluidic Electroless Ni-P Interconnection Structure | 作者: | Hung H.T Yang S Shih P.S Ma Z.D Huang J.H C. ROBERT KAO |
關鍵字: | Electronics industry; Heat treatment; Integrated circuit interconnects; Microfluidics; Microstructure; Microsystems; Nanocrystalline materials; Temperature; Thermal aging; Crystalline structure; Electroless ni-p plating; Electronic assemblies; Interconnection structure; Isothermal heat treatments; Manufacturing process; Micro-structure evolutions; Thermo compression bonding; Modified atmosphere packaging | 公開日期: | 2020 | 卷: | 2020-October | 起(迄)頁: | 172-176 | 來源出版物: | Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT | 摘要: | Microfluidic electroless interconnection (MELI) process using electroless Ni-P plating has strong advantages over thermocompression bonding (TCB) in low temperature and pressureless bonding [1,2]. However, in a typical electronic assembly process, chips can be exposed to high temperatures through subsequent manufacturing processes and service conditions. A P-rich layer (6-8 wt.%) was observed at the bonding interface of Ni-P joints in the previous research [2]. The present study aims to investigate the effects of aging treatment on Ni-P joints in terms of the formation of voids and intermetallic compounds, the changes in microstructures, and the P distribution. Three different aging temperatures, which are 150 °C, 300 °C, and 400 °C, were chosen. The results show that aging at 150 °C for 1000 h and 300 °C for 1 h have no substantial effect on Ni-P interconnections. As for the Ni-P joints thermal aging at 400 °C for 1 h, the amorphous phases were transformed into a crystalline structure consisting of Ni and Ni3P phases, increasing the homogeneity of P in the deposit. ? 2020 IEEE. |
URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85098233607&doi=10.1109%2fIMPACT50485.2020.9268611&partnerID=40&md5=03f46de4a6def0b6ec3ae7897978f303 https://scholars.lib.ntu.edu.tw/handle/123456789/576879 |
ISSN: | 21505934 | DOI: | 10.1109/IMPACT50485.2020.9268611 |
顯示於: | 材料科學與工程學系 |
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