https://scholars.lib.ntu.edu.tw/handle/123456789/576949
Title: | Corrosion and ion migration of Ag-alloy bonding wires with various Pd and Au contents | Authors: | Chen C.-H Lin Y.-C Tsai C.-H Wang S.-C Tsai H.-H Chuang T.-H. TUNG-HAN CHUANG |
Keywords: | Binary alloys; Corrosion prevention; Corrosion rate; Corrosion resistance; Corrosion resistant alloys; Corrosive effects; Electronics packaging; Ions; Palladium; Silicones; Sodium alloys; Sodium chloride; Solutions; Ternary alloys; Thermodynamics; Wire; 3.5 wt% NaCl solution; Bonding wires; Corrosion current densities; Corrosion potentials; Electronic Packaging; Encapsulation process; Ion migration; NaCl aqueous solution; Silver alloys | Issue Date: | 2017 | Source: | EUROCORR 2017 - The Annual Congress of the European Federation of Corrosion, 20th International Corrosion Congress and Process Safety Congress 2017 | Abstract: | The corrosion behaviors of Ag-alloy bonding wires with various Pd and Au contents in 3.5 wt% NaCl solution were investigated, and the results were compared with those of pure Ag wire. The results revealed that the corrosion potential for all bonding wires declined with the increase of Pd contents, indicating the decrease of the thermodynamics corrosion tendency. However, the corrosion current density of Ag-alloy wires decreased with increasing Pd content: Ag-6Pd~Ag-4.5Pd |
URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85052312567&partnerID=40&md5=bc7c4e8b9725ca30b16a4e2aa3e8857b https://scholars.lib.ntu.edu.tw/handle/123456789/576949 |
Appears in Collections: | 材料科學與工程學系 |
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