https://scholars.lib.ntu.edu.tw/handle/123456789/581087
標題: | Systematic Design for Mitigation of RF Desense by Interleaved Power Line in Two-Layer PCB | 作者: | Huang C.-M Wang S.-H Wu T.-Y Huang M.-C RUEY-BEEI WU |
關鍵字: | Electromagnetic interference (EMI); magnetic coupling; power transmission line; print circuit board (PCB) | 公開日期: | 2021 | 卷: | 11 | 期: | 5 | 起(迄)頁: | 859-864 | 來源出版物: | IEEE Transactions on Components, Packaging and Manufacturing Technology | 摘要: | The RF desense problem in wireless products becomes serious due to faster digital signals and minimal area in print circuit boards (PCBs). This article proposes a systematic design of interleaved power transmission lines to suppress electromagnetic interference due to magnetic coupling from the power delivery system of digital circuits to RF components. It improves noise suppression by more than 20 dB, in only two-layer PCB, with one power trace and three enclosing grounds to replace the conventional power trace in the same occupied area. A general design chart of isolation improvement versus trace width, spacing, and substrate thickness is constructed. Finally, the proposed concept is verified by experiment and simulation. ? 2011-2012 IEEE. |
URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85102236346&doi=10.1109%2fTCPMT.2021.3063321&partnerID=40&md5=5743133ca74d69591b002d6fe6388815 https://scholars.lib.ntu.edu.tw/handle/123456789/581087 |
ISSN: | 21563950 | DOI: | 10.1109/TCPMT.2021.3063321 | SDG/關鍵字: | Electric power transmission; Electromagnetic pulse; Conventional power; Isolation improvements; Noise suppression; Power delivery systems; Print circuit boards; Substrate thickness; Systematic designs; Wireless products; Printed circuit boards |
顯示於: | 電機工程學系 |
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