https://scholars.lib.ntu.edu.tw/handle/123456789/591133
Title: | Multiscale Modeling of Strength and Toughness of 3D IC Intermetallic Microbump | Authors: | C-H Yu C-C Lin C-S Chen CHUIN-SHAN CHEN |
Issue Date: | 2015 | Source: | First Computational Mechanics Conference in Taiwan (ACMT 2015) | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/591133 |
Appears in Collections: | 土木工程學系 |
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