|Title:||Highly Thermal Stable Polyimides Applied in Flexible Resistive Memory||Authors:||Gao J.-Y
|Keywords:||donor–acceptor;flexible electronics;polyimide;resistor-type memory;write-once-read-many (WORM) type memory;Amines;Aromatic compounds;Charge transfer;Glass transition;Polyimides;Thermal expansion;Hexafluoroisopropylidene;High-glass transition temperatures;Low coefficient of thermal expansions;Mechanical durability;ON/OFF current ratio;Resistive memory;Thermal and mechanical properties;Write-once-read-many;Flexible electronics||Issue Date:||2021||Journal Volume:||306||Journal Issue:||12||Source:||Macromolecular Materials and Engineering||Abstract:||
Flexible memory devices are one of the most crucial elements in the wearable electronics. In this work, polyimides (PIs)-based flexible resistive memory devices with an excellent thermal and mechanical durability are demonstrated. Four kinds of functional PIs are derived from the heterocyclic diamines including 2,6-diaminodibenzo-p-dioxin (OODA) and 2,6-diaminothianthrene, and dianhydrides including 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) and 3,3′,4,4′-biphenyltetracarboxylic dianhydride. PI with diamine of OODA and dianhydride of 6FDA (PI(OODA_6FDA)) possesses outstanding thermal and mechanical properties with a high glass transition temperature of 352?°C, a low coefficient of thermal expansion of 28.1?ppm K?1, and a high elongation at break of 10%. In addition, PI(OODA_6FDA)-based memory shows write-once-read-many behavior with a high on/off current ratio of 106 and a stable data retention, attributed to the donor–acceptor charge transfer between the polymer chains. The retained current levels at a low resistive state can be observed even with thermal treatment at 200?°C for 24 h or 1000 times cyclic bending at a bending radius of 5?mm. These results demonstrate the potential of heterocyclic PIs for flexible resistive memory. ? 2021 Wiley-VCH GmbH
|Appears in Collections:||化學工程學系|
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