https://scholars.lib.ntu.edu.tw/handle/123456789/598334
標題: | Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment | 作者: | Tsai C.-H Huang W.-C Chew L.M Schmitt W Li J Nishikawa H C. ROBERT KAO |
關鍵字: | Ag–In intermetallic compounds;Die attachment;Interconnection;Mechanical properties;Micro-Ag sintering;Transient liquid phase bonding;Health hazards;High temperature applications;Indium;Intermetallics;Nickel;Oxidation;Silver;Ag–in intermetallic compound;Intermetallics compounds;Low pressures;Micro-ag sintering;Nano-silver pastes;Silver pastes;Sintered joint;Transient liquid-phase bondings;Sintering | 公開日期: | 2021 | 卷: | 15 | 起(迄)頁: | 4541-4553 | 來源出版物: | Journal of Materials Research and Technology | 摘要: | Sintered silver paste is a popular material for die attachment technology in power electronics. However, using traditional nano-silver paste when fabricating sintered joints has intrinsic material problems that cannot be overcome, such as the high cost of nano-silver particles and their potential health hazards. In this study, a novel micro-silver paste was utilized for sintering and bonding to overcome the limitations of nano-silver paste. Although the micro-silver paste is an excellent candidate to replace nano-silver paste for sintering processes to reduce the potential harm to humans, the oxidation at copper substrates on both sides of the pure silver joint at 300 °C causes mechanical reliability issues in long-term high temperature applications. Therefore, a micro-silver paste was sintered with the addition of indium to address the Cu oxidation problem in this study. It was found that Ag–In intermetallic compounds (IMCs) formed through a transient liquid phase reaction. The results demonstrated that sintered joints comprising Ag–In IMCs and Ag–In solid solution phases could effectively resolve the oxidation issues and significantly enhance the high-temperature reliability. Furthermore, the Ag–In IMCs exhibited excellent mechanical properties, withstanding the thermal stress induced during the thermal cycling test. ? 2021 The Author(s) |
URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85118248953&doi=10.1016%2fj.jmrt.2021.10.079&partnerID=40&md5=145959e19b17fd8c5358b3f165582689 https://scholars.lib.ntu.edu.tw/handle/123456789/598334 |
ISSN: | 22387854 | DOI: | 10.1016/j.jmrt.2021.10.079 |
顯示於: | 材料科學與工程學系 |
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