|Title:||Organic-inorganic hybrid materials from a new octa(2 3-epoxypropyl)silsesquioxane with diamines||Authors:||Lee, Long-Hua
|Keywords:||Hybrid materials;Silsesquioxane;Epoxy||Issue Date:||2005||Publisher:||Taipei:National Taiwan University Dept Chem Engn||Journal Volume:||46||Journal Issue:||7||Start page/Pages:||2163-2174||Source:||Polymer||Abstract:||
Hybrid materials based on a new polyhedral oligomeric silsesquioxane, octa(2,3-epoxypropyl)silsesquioxane (OE) with diamines of 4,40-
methylenedianiline (DDM) and 5-trifluoromethyl-1,3-phenylenediamine (FPA) were prepared and characterized. OE was synthesized from
cage-structured octaallylsilsesquioxane (OA) with m-chloroperbenzoicacid. The FTIR studies suggested that the N–H bond in diamines was
not completely reacted with epoxy group due to steric hindrance and also extensive hydrogen bonding existed in the hybrid materials. The
retention of the cage structure in the prepared hybrid materials was suggested by the FTIR and 29Si NMR studies. The OE/FPA hybrid
materials had superior thermal/mechanical characteristics than the OE/DDM due to the higher rigidity of the FPA than that of DDM or the
silicon-fluorine interaction enhancing crosslinking reaction or hydrogen bonding. The prepared OE/FPA had a Tg of 170 8C, which was
higher than diglycidyl ether of bisphenyl A (DGEBA)/DDM at the same stoichiometric ratio. It also had excellent thermal, mechanical, and
dielectric characteristics with high storage modulus of 1.8 GPa (30 8C) and 0.3 GPa (250 8C), low coefficient of thermal expansion of
86 mm/m 8C, and dielectric constant of 2.19. Thus, it can be high performance materials with potential applications for electronic packaging.
|Appears in Collections:||化學工程學系|
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