https://scholars.lib.ntu.edu.tw/handle/123456789/625194
標題: | Microstructure evolution and failure mechanism of electromigration in Ag-alloy bonding wire | 作者: | Chen C.-H Lee P.-I TUNG-HAN CHUANG |
關鍵字: | Coincidence site lattice (CSL); Diffusion mechanism; Electromigration; Electron backscatter diffraction (EBSD); Texture evolution | 公開日期: | 2022 | 卷: | 913 | 來源出版物: | Journal of Alloys and Compounds | 摘要: | Ag-alloy bonding wire has excellent physical properties and is widely applied in microelectronics, but growing concerns about circuit failure induced by electromigration (EM) have raised doubts about this material. One point of frequent debate is the diffusion mechanism. This study provides a novel perspective by investigating the evolution of the microstructure via electron backscatter diffraction (EBSD) to settle the controversy over the diffusion mechanism of Ag-alloy bonding wire during EM. Particular focuses are the propensity for grain growth, the effects of the coincidence site lattice (CSL) on the grain boundary network, the texture transition, and the influence of thermal energy during EM. A stage-like transition in the dominant diffusion mechanism in different stages of EM is proposed and substantiated from the viewpoint of microstructure evolution. © 2022 Elsevier B.V. |
URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85129814671&doi=10.1016%2fj.jallcom.2022.165266&partnerID=40&md5=e5511fd3de6761a00d009c246d485909 https://scholars.lib.ntu.edu.tw/handle/123456789/625194 |
ISSN: | 09258388 | DOI: | 10.1016/j.jallcom.2022.165266 | SDG/關鍵字: | Backscattering; Crystal lattices; Diffusion; Electron diffraction; Failure (mechanical); Grain boundaries; Grain growth; Microelectronics; Silver alloys; Textures; Wire; Ag-alloy; Bonding wires; Coincidence site lattice; Coincidence site lattices; Diffusion mechanisms; Electron back scatter diffraction; Electron backscatter diffraction; Microstructure evolutions; Texture evolutions; Electromigration |
顯示於: | 材料科學與工程學系 |
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