https://scholars.lib.ntu.edu.tw/handle/123456789/625220
標題: | Experimental investigation of vapor chamber | 作者: | Chiang Y.-C Cheng C.-H Chang Y.-W Lai C.-L SIH-LI CHEN |
關鍵字: | Boiling-condensation; Fill-ratio; Thermal performance; Vapor chamber | 公開日期: | 2007 | 起(迄)頁: | 984-991 | 來源出版物: | Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007 | 摘要: | The present work experimentally investigates the thermal performance of the vapor chamber module. Vapor chamber utilizes boiling-condensation mechanism to achieve high heat transfer capability and heat spreading performance. The experimental parameters are heating power, fill-ratio of working fluid, and size of heating area. In the results, the device performs better at high heating power. The best fill-ratio for the vapor chamber is 30%, with which the vapor chamber resistance reaches the best performance of 0.1°C/W at 180W. A smaller heating area leads to a worse vapor chamber resistance. Besides, this study also compares the thermal performances between vapor chamber and an equal-sized copper plate. The results show that the heat transfer capability and heating spreading performance of the vapor chamber are all better than those of the copper plate. |
URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84876909551&partnerID=40&md5=27f08739483f52c7fcb4f697d413502c https://scholars.lib.ntu.edu.tw/handle/123456789/625220 |
SDG/關鍵字: | Boiling-condensation; Experimental investigations; Experimental parameters; Fill-ratio; Heat transfer capability; High heat transfers; Thermal Performance; Vapor chamber; Condensation; Copper; Heating; Microelectronics; Mixed convection; Vapors |
顯示於: | 機械工程學系 |
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