https://scholars.lib.ntu.edu.tw/handle/123456789/631943
標題: | Multi-Layer Chips on Wafer Stacking Technologies with Carbon Nano-Tubes as Through-Silicon Vias and it's potential applications for Power-Via technologies | 作者: | Liao, Bo Zhou Chen, Liang Hsi Chen, Kai Cheng Lin, Hong Yi Tsai, Yi Ting Chen, Ting Wei Chan, Yi Cheng Lee, Min Hung MING-HAN LIAO |
關鍵字: | 3DIC | CNT | signal integrity | thermal conductivity | TSV | 公開日期: | 1-一月-2022 | 卷: | 2022-May | 來源出版物: | Proceedings - Electronic Components and Technology Conference | 摘要: | In this work, carbon nanotubes (CNTs) are grown as advanced filler materials in through-silicon via (TSV). Electrical and thermal properties of CNTs are extracted by experiments and the implementation of multi-layer stacking is proposed. The resistance and thermal conductivity of CNT are measured as 10.5 ohm and 49 W/mK respectively. In accordance with its superior properties over copper, Carbon nanotubes as TSVs (CNT-TSV) have several advantages in three-dimensional integrated circuit (3DIC) technology. Signal integrity index, namely return loss and insertion loss have been evaluated by ANSYS HFSS (High frequency Structure Simulator). Within the high frequency interval (10~20 GHz), CNT-TSV has better electrical characteristics than copper. In summary, CNTs can be a promising material used in future chip on wafer stacking process. |
URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/631943 | ISBN: | 9781665479431 | ISSN: | 05695503 | DOI: | 10.1109/ECTC51906.2022.00285 |
顯示於: | 機械工程學系 |
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