https://scholars.lib.ntu.edu.tw/handle/123456789/632795
標題: | Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps | 作者: | Kao, Chen Wei Kung, Po Yu Chang, Chih Chia Huang, Wei Chen Chang, Fu Ling C. ROBERT KAO |
關鍵字: | adhesion layer | intermetallic | micro-joints | solid-state reaction | 公開日期: | 1-六月-2022 | 出版社: | MDPI | 卷: | 15 | 期: | 12 | 來源出版物: | Materials | 摘要: | The use of scaled-down micro-bumps in miniaturized consumer electronic products has led to the easy realization of full intermetallic solder bumps owing to the completion of the wetting layer. However, the direct contact of the intermetallic compounds (IMCs) with the adhesion layer may pose serious reliability concerns. In this study, the terminal reaction of the Ti adhesion layer with Cu–Sn IMCs was investigated by aging the micro-bumps at 200 °C. Although all of the microbumps transformed into intermetallic structures after aging, they exhibited a strong attachment to the Ti adhesion layer, which differs significantly from the Cr system where spalling of IMCs oc-curred during the solid-state reaction. Moreover, the difference in the diffusion rates between Cu and Sn might have induced void formation during aging. These voids progressed to the center of the bump through the depleting Cu layer. However, they neither affected the attachment between the IMCs and the adhesion layer nor reduced the strength of the bumps. In conclusion, the IMCs demonstrated better adhesive behavior with the Ti adhesion layer when compared to Cr, which has been used in previous studies. |
URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/632795 | ISSN: | 1996-1944 | DOI: | 10.3390/ma15124297 |
顯示於: | 材料科學與工程學系 |
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