https://scholars.lib.ntu.edu.tw/handle/123456789/632801
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Grafner, S. J. | en_US |
dc.contributor.author | Huang, J. H. | en_US |
dc.contributor.author | Chen, Y. A. | en_US |
dc.contributor.author | Shih, P. S. | en_US |
dc.contributor.author | Huang, C. H. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.date.accessioned | 2023-06-16T07:22:47Z | - |
dc.date.available | 2023-06-16T07:22:47Z | - |
dc.date.issued | 2022-01-01 | - |
dc.identifier.isbn | 9781665479431 | - |
dc.identifier.issn | 05695503 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/632801 | - |
dc.description.abstract | The electroless plating process is probably one of the most promising methods to overcome the barriers of the solder technology in scaling-down fine-pitch interconnection in the chip packaging industry. To optimize this process, we propose the usage of numerical simulation as a key step towards mass production. This study develops two fundamental simulation models for a rectangular and diamond pattern of pillars, respectively. For both arrangements, the pressure drop and further flow characteristics are investigated dependent on the following parameters: pillar diameter D, pitch-to-diameter ratio S/D and height-to-diameter ratio H/D and superficial velocity U. The results show that a lower pressure drop can be achieved for higher values of these three geometrical parameters. The flow in a rectangular pattern is more likely to form vortices between the wake and front region of the pillars and to form a focused stream between the side areas of the pillars for high D, low S/D, high H/D and high U. The diamond array is less likely for vortex generation and favors to form an S-shaped stream through the arrangement of pillars. However, the pressure drop of the diamond pattern tends to be considerably higher compared to the rectangular counterpart for large D, high S/D and high H/D due to enhanced stagnation forces. Moreover, the developed numerical models show a good match with experimental data from the literature. | en_US |
dc.relation.ispartof | Proceedings - Electronic Components and Technology Conference | en_US |
dc.subject | CFD | Electroless plating | Mass production | Microchannel | Pillars | en_US |
dc.title | Key steps from laboratory towards mass production: Optimization of electroless plating process through numerical simulation | en_US |
dc.type | conference paper | en_US |
dc.identifier.doi | 10.1109/ECTC51906.2022.00091 | - |
dc.identifier.scopus | 2-s2.0-85134693723 | - |
dc.identifier.url | https://api.elsevier.com/content/abstract/scopus_id/85134693723 | - |
dc.relation.journalvolume | 2022-May | en_US |
dc.relation.pageend | 547 | en_US |
item.fulltext | no fulltext | - |
item.cerifentitytype | Publications | - |
item.openairetype | conference paper | - |
item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
item.grantfulltext | none | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
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