https://scholars.lib.ntu.edu.tw/handle/123456789/634041
標題: | Interfacial Reaction between Silver and Solid Indium | 作者: | Fang, I. C. Chang, F. L. Chang, C. C. C. ROBERT KAO |
關鍵字: | indium | interfacial reaction | intermetallic compounds | kinetics | silver | 公開日期: | 1-一月-2023 | 來源出版物: | 2023 International Conference on Electronics Packaging, ICEP 2023 | 摘要: | In this research, the interfacial reactions between solid silver and solid indium are discussed. The samples are fabricated by electroplating indium on silver substrates and then underwent aging at 80, 100 and 120. After aging, two intermetallic compounds (IMCs) layers, Ag2In and AgIn2, were found at the interface of silver and indium. Both I MCs grow with time during the aging process. The growth rate of Ag2In and AgIn2 increases with temperature and follows parabolic law, implying that the growth of Ag2In and AgIn2 are both diffusion-controlled reactions. |
URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/634041 | ISBN: | 9784991191152 | DOI: | 10.23919/ICEP58572.2023.10129748 |
顯示於: | 材料科學與工程學系 |
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