https://scholars.lib.ntu.edu.tw/handle/123456789/74661
Title: | Effect of Surface Finish on the Failure Mechanisms of Flip-Chip Solder Joints Under Electromigration | Authors: | Lin, Y.L. Lai, Y.S. Tsai, C.M. Kao, C.R. |
Issue Date: | 2006 | Journal Volume: | 35 | Journal Issue: | 12 | Start page/Pages: | 2147-2153 | Source: | Journal of Electronic Materials | URI: | http://ntur.lib.ntu.edu.tw//handle/246246/95481 |
Appears in Collections: | 材料科學與工程學系 |
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