https://scholars.lib.ntu.edu.tw/handle/123456789/74664
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chang, Chien Wei | en |
dc.contributor.author | Yang, Su Chun | en |
dc.contributor.author | Tu, Chun-Te | en |
dc.contributor.author | Kao, C. Robert | en |
dc.creator | Chang, Chien Wei; Yang, Su Chun; Tu, Chun-Te; Kao, C. Robert | - |
dc.date | 2007 | en |
dc.date.accessioned | 2008-12-31T02:25:16Z | - |
dc.date.accessioned | 2018-06-28T22:00:41Z | - |
dc.date.available | 2008-12-31T02:25:16Z | - |
dc.date.available | 2018-06-28T22:00:41Z | - |
dc.date.issued | 2007 | - |
dc.identifier.uri | http://ntur.lib.ntu.edu.tw//handle/246246/95484 | - |
dc.format | application/pdf | en |
dc.format.extent | 559659 bytes | - |
dc.format.mimetype | application/pdf | - |
dc.language | en | en |
dc.language.iso | en_US | - |
dc.relation | Journal of Electronic Materials 36 (11): 1455-1461 | en |
dc.relation.ispartof | Journal of Electronic Materials | - |
dc.title | Cross-Interaction between Ni and Cu across Sn Layers with Different Thickness | en |
dc.type | journal article | en |
dc.relation.pages | 1455-1461 | - |
dc.relation.journalvolume | 36 | - |
dc.relation.journalissue | 11 | - |
dc.identifier.uri.fulltext | http://ntur.lib.ntu.edu.tw/bitstream/246246/95484/1/07.pdf | - |
item.openairetype | journal article | - |
item.fulltext | with fulltext | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.grantfulltext | open | - |
item.languageiso639-1 | en_US | - |
item.cerifentitytype | Publications | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
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