https://scholars.lib.ntu.edu.tw/handle/123456789/74667| Title: | Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration | Authors: | Lin, Y.L. Lai, Y.S. Lin, Y.W. Kao, C.R. |
Issue Date: | 2008 | Journal Volume: | 37 | Journal Issue: | 1 | Start page/Pages: | 96-101 | Source: | Journal of Electronic Materials | URI: | http://ntur.lib.ntu.edu.tw//handle/246246/95487 |
| Appears in Collections: | 材料科學與工程學系 |
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