https://scholars.lib.ntu.edu.tw/handle/123456789/75205
Title: | Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish | Authors: | Chuang, Tung-Han Yen, Shiu-Fang Wu, Hui-Min |
Issue Date: | 2006 | Journal Volume: | 35 | Journal Issue: | 2 | Start page/Pages: | 310-318 | Source: | Journal of Electronic Materials | URI: | http://ntur.lib.ntu.edu.tw//handle/246246/95953 |
Appears in Collections: | 材料科學與工程學系 |
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