https://scholars.lib.ntu.edu.tw/handle/123456789/75217
Title: | Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads | Authors: | Lin, W.H. Wu, Albert T. Lin, S.Z. Chuang, T.H. Tu, K.N. |
Issue Date: | 2007 | Journal Volume: | 36 | Journal Issue: | 7 | Start page/Pages: | 753-759 | Source: | Journal of Electronic Materials | URI: | http://ntur.lib.ntu.edu.tw//handle/246246/95965 |
Appears in Collections: | 材料科學與工程學系 |
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