https://scholars.lib.ntu.edu.tw/handle/123456789/75590| Title: | Effect of the gold thickness of the surface finish on the interfacial reactions in flip chip solder joints | Authors: | Lin, Y. L. Luo, W. C. Lin, Y. H. Ho, C. E. Kao, and C. R. |
Issue Date: | Oct-2004 | Journal Volume: | 33 | Journal Issue: | 10 | Start page/Pages: | 1092-1097 | Source: | Journal of Electronic Materials | URI: | http://ntur.lib.ntu.edu.tw//handle/246246/198772 |
| Appears in Collections: | 材料科學與工程學系 |
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