https://scholars.lib.ntu.edu.tw/handle/123456789/75618
Title: | Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni | Authors: | Ho, C. E. Tsai, R. Y. Lin, Y. L. Kao, and C. R. |
Issue Date: | Jun-2002 | Journal Volume: | 31 | Journal Issue: | 6 | Start page/Pages: | 584-590 | Source: | Journal of Electronic Materials | URI: | http://ntur.lib.ntu.edu.tw//handle/246246/198836 |
Appears in Collections: | 材料科學與工程學系 |
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