https://scholars.lib.ntu.edu.tw/handle/123456789/75783
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chen, W.M. | en_US |
dc.contributor.author | Kang, S.K. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | Chen, W.M.;Kang, S.K.;Kao, C.R. | en |
dc.date | 2012 | en |
dc.date.accessioned | 2012-10-24T11:17:24Z | - |
dc.date.accessioned | 2018-06-28T22:23:55Z | - |
dc.date.available | 2012-10-24T11:17:24Z | - |
dc.date.available | 2018-06-28T22:23:55Z | - |
dc.date.issued | 2012 | - |
dc.identifier.uri | https://www.scopus.com/record/display.uri?eid=2-s2.0-84862825280&origin=resultslist&sort=plf-f&src=s&sid=8cb953b3aa70a701e586a8160ace9e85&sot=b&sdt=b&s=TITLE-ABS-KEY%28Effects+of+Ti+addition+to+Sn%E2%80%93Ag+and+Sn%E2%80%93Cu+solders%29&sl=64&sessionSearchId=8cb953b3aa70a701e586a8160ace9e85&relpos=9 | - |
dc.language | en | en |
dc.language.iso | en_US | - |
dc.relation | Journal of Alloys and Compounds, 520, 244-249 | en |
dc.relation.ispartof | Journal of Alloys and Compounds | - |
dc.title | Effects of Ti addition to Sn–Ag and Sn–Cu solders | en |
dc.type | journal article | en |
dc.identifier.doi | 10.1016/j.jallcom.2012.01.032 | en |
dc.identifier.scopus | 2-s2.0-84862825280 | - |
dc.relation.pages | 244-249 | - |
dc.relation.journalissue | 520 | - |
dc.identifier.uri.fulltext | http://ntur.lib.ntu.edu.tw/bitstream/246246/243599/-1/39.pdf | - |
item.fulltext | with fulltext | - |
item.cerifentitytype | Publications | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.grantfulltext | open | - |
item.openairetype | journal article | - |
item.languageiso639-1 | en_US | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。