https://scholars.lib.ntu.edu.tw/handle/123456789/75873| Title: | Experimental Evidence for Formation of Ni-Al Compound in Flip-Chip Joints Under Current Stressing | Authors: | Tsai, M.Y. Lin, Y.L. Tsai, M.H. Chen, Y.J. Kao, C.R. |
Issue Date: | 2011 | Journal Volume: | 40 | Journal Issue: | 10 | Start page/Pages: | 2076-2080 | Source: | Journal of ELECTRONIC MATERIALS | URI: | http://ntur.lib.ntu.edu.tw//handle/246246/243689 | DOI: | 10.1007/s11664-011-1719-5 |
| Appears in Collections: | 材料科學與工程學系 |
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