https://scholars.lib.ntu.edu.tw/handle/123456789/75886
Title: | Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints | Authors: | Liu, Chao Sheng Ho, Cheng En Peng, Cheng Sam C. ROBERT KAO |
Issue Date: | 2011 | Journal Volume: | 40 | Journal Issue: | 9 | Start page/Pages: | 1912-1920 | Source: | Journal of electronic materials | URI: | http://ntur.lib.ntu.edu.tw//handle/246246/243702 | DOI: | 10.1007/s11664-011-1666-1 |
Appears in Collections: | 材料科學與工程學系 |
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