https://scholars.lib.ntu.edu.tw/handle/123456789/75981| Title: | Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder Joints | Authors: | Chuang, Tung-Han Wu, Hsing-Fei |
Issue Date: | 2011 | Start page/Pages: | 71-77 | Source: | Journal of Electronic Materials | URI: | http://ntur.lib.ntu.edu.tw//handle/246246/243797 | DOI: | 10.1007/s11664-010-1385-z |
| Appears in Collections: | 材料科學與工程學系 |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.