https://scholars.lib.ntu.edu.tw/handle/123456789/76008| Title: | Effects of Ni Additions on the Growth of Cu3Sn in High-Lead Solders | Authors: | Wang, Y.W. Chang, C.C. Chen, W.M. Kao, C.R. |
Issue Date: | 2010 | Start page/Pages: | 2636-2642 | Source: | Journal of Electronic Materials | URI: | http://ntur.lib.ntu.edu.tw//handle/246246/243824 | DOI: | 10.1007/s11664-010-1317-y |
| Appears in Collections: | 材料科學與工程學系 |
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