https://scholars.lib.ntu.edu.tw/handle/123456789/76045
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chuang, H.Y. | en_US |
dc.contributor.author | Lin, C.H. | en_US |
dc.contributor.author | Chu, J.P. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | Chuang, H.Y.;Lin, C.H.;Chu, J.P.;Kao, C.R. | en |
dc.date | 2010 | en |
dc.date.accessioned | 2012-10-24T11:49:33Z | - |
dc.date.accessioned | 2018-06-28T22:30:58Z | - |
dc.date.available | 2012-10-24T11:49:33Z | - |
dc.date.available | 2018-06-28T22:30:58Z | - |
dc.date.issued | 2010 | - |
dc.identifier.uri | https://www.scopus.com/record/display.uri?eid=2-s2.0-77955412522&origin=resultslist&sort=plf-f&src=s&sid=71011588b997c96b22b7221bdcbc0d09&sot=b&sdt=b&s=TITLE-ABS-KEY%28Novel+Cu-RuNx+composite+layer+with+good+solderability+and+very+low+consumption+rate%29&sl=98&sessionSearchId=71011588b997c96b22b7221bdcbc0d09&relpos=0 | - |
dc.language | en | en |
dc.language.iso | en_US | - |
dc.relation | Journal of Alloys and Compounds, 504(2), L25-L27 | en |
dc.relation.ispartof | Journal of Alloys and Compounds | en_US |
dc.title | Novel Cu-RuNx composite layer with good solderability and very low consumption rate | en |
dc.type | journal article | en |
dc.identifier.doi | 10.1016/j.jallcom.2010.05.131 | en |
dc.identifier.scopus | 2-s2.0-77955412522 | - |
dc.relation.pages | - | - |
dc.relation.journalvolume | 504 | - |
dc.relation.journalissue | 2 | - |
dc.identifier.uri.fulltext | http://ntur.lib.ntu.edu.tw/bitstream/246246/243861/-1/305.pdf | - |
item.fulltext | with fulltext | - |
item.cerifentitytype | Publications | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.grantfulltext | open | - |
item.openairetype | journal article | - |
item.languageiso639-1 | en_US | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
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