https://scholars.lib.ntu.edu.tw/handle/123456789/76061
標題: | Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni | 作者: | Yang, S.C. Chang, C.C. Tsai, M.H. C. ROBERT KAO |
公開日期: | 2010 | 起(迄)頁: | 149-153 | 來源出版物: | Journal of Alloys and Compounds | URI: | https://www.scopus.com/record/display.uri?eid=2-s2.0-77953131590&origin=resultslist&sort=plf-f&src=s&sid=a96a0525f826ba1363b866baacd55e56&sot=b&sdt=b&s=TITLE-ABS-KEY%28Effect+of+Cu+concentration%2C+solder+volume%2C+and+temperature+on+the+reaction+between+SnAgCu+solders+and+Ni%29&sl=119&sessionSearchId=a96a0525f826ba1363b866baacd55e56&relpos=0 | DOI: | 10.1016/j.jallcom.2010.03.168 |
顯示於: | 材料科學與工程學系 |
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