https://scholars.lib.ntu.edu.tw/handle/123456789/76086
Title: | Electromigration in flip chip solder joints under extra high current density | Authors: | Lin, Y.W. Ke, J.H. Chuang, H.Y. Lai, Y.S. C. ROBERT KAO |
Issue Date: | 2010 | Start page/Pages: | 73516 | Source: | Journal of Applied Physics | URI: | http://ntur.lib.ntu.edu.tw//handle/246246/243902 | DOI: | 10.1063/1.3371711 |
Appears in Collections: | 材料科學與工程學系 |
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