https://scholars.lib.ntu.edu.tw/handle/123456789/76099
標題: | The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering | 作者: | Lin, Y.W. Wang, Y.W. C. ROBERT KAO CHIEN-CHENG CHANG |
公開日期: | 2010 | 起(迄)頁: | 99-104 | 來源出版物: | Journal of Alloys and Compounds | URI: | https://www.scopus.com/record/display.uri?eid=2-s2.0-76549094388&origin=resultslist&sort=plf-f&src=s&sid=3386dbe0d0c2eda2c872000cae6c24d2&sot=b&sdt=b&s=TITLE-ABS-KEY%28The+effects+of+solder+volume+and+Cu+concentration+on+the+consumption+rate+of+Cu+pad+during+reflow+soldering%29&sl=122&sessionSearchId=3386dbe0d0c2eda2c872000cae6c24d2&relpos=0 | DOI: | 10.1016/j.jallcom.2009.11.088 |
顯示於: | 材料科學與工程學系 |
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