https://scholars.lib.ntu.edu.tw/handle/123456789/79817
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lee, Chi-Yuan | en |
dc.contributor.author | Chang, Pei-Zen | en |
dc.contributor.author | Chen, Yung-Yu | en |
dc.contributor.author | Dai, Ching-Liang | en |
dc.contributor.author | Wang, Xuan-Yu | en |
dc.contributor.author | Chen, Ping-Hei | en |
dc.contributor.author | Lee, Shuo-Jen | en |
dc.creator | Lee, Chi-Yuan; Chang, Pei-Zen; Chen, Yung-Yu; Dai, Ching-Liang; Wang, Xuan-Yu; Chen, Ping-Hei; Lee, Shuo-Jen | - |
dc.date | 2006-05 | en |
dc.date.accessioned | 2009-01-21T08:03:31Z | - |
dc.date.accessioned | 2018-06-29T00:08:45Z | - |
dc.date.available | 2009-01-21T08:03:31Z | - |
dc.date.available | 2018-06-29T00:08:45Z | - |
dc.date.issued | 2006-05 | - |
dc.identifier.uri | http://ntur.lib.ntu.edu.tw//handle/246246/106996 | - |
dc.language.iso | en_US | - |
dc.relation | Sensors and Materials 18 (2): 71-82 | en |
dc.relation.ispartof | Sensors and Materials | en_US |
dc.title | Novel Method for In-Situ Monitoring of Thickness of Silicon Wafer during Wet Etching | en |
dc.identifier.scopus | 2-s2.0-33745785227 | - |
dc.identifier.isi | WOS:000238800300002 | - |
dc.relation.pages | 71-82 | - |
dc.relation.journalvolume | 18 | - |
dc.relation.journalissue | 2 | - |
item.languageiso639-1 | en_US | - |
item.grantfulltext | none | - |
item.fulltext | no fulltext | - |
crisitem.author.dept | Applied Mechanics | - |
crisitem.author.orcid | 0000-0002-4054-6791 | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 應用力學研究所 |
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