https://scholars.lib.ntu.edu.tw/handle/123456789/80916
標題: | 積體電路相容微機電系統之研究-子計畫四: 積體電路相容微機電關鍵技術之研究(I) | 作者: | 張培仁 | 公開日期: | 31-七月-2004 | 出版社: | 臺北市:國立臺灣大學應用力學研究所 | 摘要: | 本研究利用CMOS-MEMS 技術研製一微 型鏡面陣列(micromirror array)。亦即,以積體 電路晶圓代工廠所提供之標準CMOS 0.35μm 製程,同時配合微機電(MEMS)後製程技術來 製作一數位式微型光連結裝置(digital multi-direction optical interconnect device)。主 要目的乃期望能針對傳統大型光網路連結或 是空間光內連結裝置的尺度和效能等提出一 個切實可行的先期研發方案,此外基於光學微 機電裝置之低插入損失(insertion loss)、和切換 損失,此類的微型裝置亦十分切合現今所謂的 短距離無線通訊(雷射通訊)之需求,如機房主 機內部之I/O 切換或是通道擷取等等。 This work describes the fabrication of a micromachined micromirror by the conventional 0.35μm CMOS process and a simple maskless post-CMOS process. The micromirror contains a rectangular mirror plate and four pairs of serpentine supported beams, is integrated with a 1×4 demultiplexer and a four-stage charge pump circuits on a chip. Maskless dry and wet etching processes are the only requirement to suspend the structure. The primary limitation in the fabrication of microstructures has been overcome by the development of a hybrid processing technique, which combines both an anisotropic dry etch and an isotropic wet etch step. A highly reliable wet etching step with high selectivity between aluminum and sacrificial oxide is also reported. Experimental results reveal that the micromirror has a tilting angle of around 5° at operation voltage of 22.5 V and a dynamic response less than 5 ms. The surface properties of the CMOS micromirror, detailed process flows, measurement set-up and the results are also presented in this work. |
URI: | http://ntur.lib.ntu.edu.tw//handle/246246/21715 | 其他識別: | 922212E002092 | Rights: | 國立臺灣大學應用力學研究所 |
顯示於: | 應用力學研究所 |
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922212E002092.pdf | 155.62 kB | Adobe PDF | 檢視/開啟 |
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