公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2010 | RC passive equalizer for through silicon via | R.-B. Sun; C.-Y. Wen; RUEY-BEEI WU | 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010 | | | |
2023 | Realization of Miniatured Wi-Fi 6E Bandpass Filters on a Low-Loss Organic Substrate | Lin, Xin Ping; Chen, Chi Feng; RUEY-BEEI WU ; Wang, Chin Sheng | IEEE Transactions on Components, Packaging and Manufacturing Technology | 0 | | |
2014 | Recent progress of advanced microwave and system-in-package integration technologies at National Taiwan University | H. Wang; RUEY-BEEI WU | 2014 Asia-Pacific Microwave Conference | | | |
2009 | Reduction in Reflections and Ground Bounce for Signal Line Over Slotted Power Plane Using Differential Coupled Microstrip Lines | G.-H. Shiue; RUEY-BEEI WU | IEEE Transactions on Advanced Packaging | 28 | 18 | |
2003 | Reduction in reflections and ground bounce for signal line through a split power plane by using differential coupled microstrip lines | Shiue, Guang-Hwa; RUEY-BEEI WU | Electrical Performance of Electronic Packaging | 13 | 0 | |
2019 | Reduction of common-mode noise in bent differential interconnects for PAM4 signaling | Deroo, A.; Huynen, M.; Rogier, H.; Van Den Brande, Q.; Ginste, D.V.; Chan, H.-W.; RUEY-BEEI WU | IEEE Electrical Design of Advanced Packaging and Systems Symposium | | | |
2008 | Reflection enhanced compensation of lossy traces for best eye-diagram improvement using high-impedance mismatch | W.-D. Guo; F.-N. Tsai; G.-H. Shiue; RUEY-BEEI WU | IEEE Transactions on Advanced Packaging | | | |
2007 | Reflectionless design for differential via transitions using neural network-based approach | Y. S. Jeng; W. D. Guo; G. H. Shiue; C. M. Lin; RUEY-BEEI WU | IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging | | | |
2004 | Research on Microwave and Millimeter-wave Technologies at National Taiwan University | H. Wang; R. B. Wu; H.-C. Lu; T.-H. Chu; P. Hsu; S.-S. Lu; C. H. Chen; RUEY-BEEI WU | 2004 Asia-Pacific Microwave Conference Proceedings | | | |
1992 | Resistance computations for multilayer packaging structures by applying the boundary element method | RUEY-BEEI WU | IEEE Transactions on Components, Hybrids, and Manufacturing Technologies | | 3 | |
1989 | Resistance modeling of periodically perforated mesh planes in multilayer packaging structures | Wu, Ruey-Beei | IEEE Transactions on Components, Hybrids, and Manufacturing Technology | 0 | 0 | |
2015 | Ringing noise suppression for differential signaling in unshielded flexible flat cable | S.-Y. Huang; T.-Y. Huang; C.-T. Liu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | | 3 | |
2015 | SAVE and iEMPT: The em revitalization program in Taiwan | Ma, T.-G.; Liao, W.-J.; Chen, S.-Y.; Wu, T.-L.; Wu, R.-B.; Hsu, H.-T.; Peng, S.T.; Tsai, Z.-M.; Pang, Y.-H.; Yu, H.-H.; Tu, J.-M.; RUEY-BEEI WU ; TZONG-LIN WU ; SHIH-YUAN CHEN | IEEE Antennas and Propagation Society, AP-S International Symposium (Digest) | 0 | 0 | |
2022 | A Scalable Matching Mechanism for Online Heterogeneous Positioning Fusion System | Chen C.-Y; RUEY-BEEI WU | IEEE Radio and Wireless Symposium, RWS | 1 | 0 | |
1985 | Scalar wave analysis of dielectric waveguides using conformal mapping technique | R. B. Wu; C. H. Chen; RUEY-BEEI WU | 1985 International Symposium on Antennas and Propagation | | | |
1984 | Scattering analysis of optical fibers in spectral domain | R. B. Wu; C. H. Chen; RUEY-BEEI WU | Antennas and Propagation Society International Symposium | | | |
2018 | Semiconductor Package Assembly with Through Silicon Via Interconnect | RUEY-BEEI WU | | | | |
2019 | SI analysis of electro-optic interconnects for next generation SerDes in WLP-SiP | Lin, Y.-S.; RUEY-BEEI WU | IEEE Electrical Design of Advanced Packaging and Systems Symposium | | | |
2011 | SI-aware layout and equalizer design to enhance performance of high-speed links in blade servers | Y.-S. Cheng; H.-H. Lu; M. Chang; S. Chang; B. Liu; RUEY-BEEI WU | IEEE 20th Topical Meeting on Electrical Performance of Electronic Packaging | | | |
2013 | SI-aware vias and contact pads layouts and L-R equalization technique for 12Gb/s backplane serial I/O interconnections | Y.-S. Cheng; B. Liu; RUEY-BEEI WU | IEEE Transactions on Electromagnetic Compatibility | | 3 | |