公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2004 | Cross-interaction of UBM and soldering pad in flip-chip solder joints | Tsai, C. M.; Luo, W. C.; Chang, C. W.; Shieh, Y. C.; Kao, and C. R. | Journal of Electronic Materials | | | |
2005 | Electromigration induced metal dissolution in flip-chip solder joints | Lin, Y. H.; Tsai, C. M.; Hu, Y. C.; Lin, Y. L.; Tsai, J. Y.; Kao, C. R.; C. ROBERT KAO | Pricm 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing, Pts 1-5 | | | |
2010 | Landscaping Taiwan’s cultural heritages- The implementation of the TELDAP collection-level description | Chen, H. H.; Tsai, C. M.; Ho, Y. C. | Proceedings of the International Conference on Asian Digital Libraries | | | |
2010 | Landscaping Taiwan’s cultural heritages- The implementation of the TELDAP collection-level description | HSUEH-HUA CHEN ; Tsai, C. M.; Ho, Y. C. | | | | |
2008 | Pronounced electromigration of Cu in molten Sn-based solders | Huang, J. R.; Tsai, C. M.; Lin, Y. W.; Kao, C. R. | Journal of Materials Research | | | |
1990 | Solving the Travelling Salesman Problem Using Hopfield Nets with Time- Varying Energy Function | 王勝德 ; Tsai, C. M.; Wang, Seng-De | International Computer Symposium | | | |