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S.-T. Chen
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2005
Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits
TZONG-LIN WU
; Y.-H. Lin; T.-K. Wang; C.-C. Wang; S.-T. Chen
IEEE Transactions on Microwave Theory and Techniques
187
2005
High electromagnetic immunity power/ground planes using L-bridged electromagnetic bandgap (EBG) structure
H.-C. Kuo; S.-T. Chen; C.-C. Wang; S.-W. Wen; H.-C. Li; C.-C. Chien; TZONG-LIN WU
Asia-Pacific Symp. Electromagn. Compat.
2006
Improving the radiated immunity of the strip-lines using a novel hybrid EBG structure
H.-C. Kuo; S.-T. Chen; TZONG-LIN WU
IEEE Elect. Performance Electron. Package. Systems
2007
Modeling noise coupling between package and PCB power/ground planes with an efficient 2-D FDTD/lumped element method
T.-K. Wang; S.-T. Chen; C.-W. Tsai; S.-M. Wu; J. J. Drewniak; TZONG-LIN WU
IEEE Transactions on Advanced Packaging
2004
Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speed digital PCB
TZONG-LIN WU
; S.-T. Chen; J.-N. Huang; Y.-H. Lin
IEEE Transactions on Electromagnetic Compatibility
2005
Photonic crystal pwer substrate for wideband suppression of power/ground bounce noise and radiated emission in high-speed packages
S.-T. Chen; T.-S. Horng; TZONG-LIN WU
Asia-Pacific Symp. Electromagn. Compat.