公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2007 | Modeling noise coupling between package and PCB power/ground planes with an efficient 2-D FDTD/lumped element method | T.-K. Wang; S.-T. Chen; C.-W. Tsai; S.-M. Wu; J. J. Drewniak; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | |||
2004 | Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speed digital PCB | TZONG-LIN WU ; S.-T. Chen; J.-N. Huang; Y.-H. Lin | IEEE Transactions on Electromagnetic Compatibility | |||
2005 | Photonic crystal pwer substrate for wideband suppression of power/ground bounce noise and radiated emission in high-speed packages | S.-T. Chen; T.-S. Horng; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. |