公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2016 | Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced Packages | Tsai, C.-H.; Chuang, C.-H.; Tsai, H.-H.; Lee, J.-D.; Chang, D.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
2014 | Mechanism of Electromigration in Ag-Alloy Bonding Wires with Different Pd and Au Content | Chuang, T.-H.; Lin, H.-J.; Wang, H.-C.; Chuang, C.-H.; Tsai, C.-H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2018 | Mechanism of the Electromigration in Ag-Pd Alloy Bonding Wires | Chuang, T.-H.; Chen, C.-H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2016 | Microstructures and optoelectronic properties of Cu<inf>x</inf>O films deposited by high-power impulse magnetron sputtering | Sun, H.; Wen, C.-K.; Chen, S.-C.; Chuang, T.-H.; Arab Pour Yazdi, M.; Sanchette, F.; Billard, A.; TUNG-HAN CHUANG | Journal of Alloys and Compounds | | | |
2017 | Microstructures and optoelectronic properties of nickel oxide films deposited by reactive magnetron sputtering at various working pressures of pure oxygen environment | Sun, H.; Chen, S.-C.; Hsu, S.-W.; Wen, C.-K.; Chuang, T.-H.; Wang, X.; TUNG-HAN CHUANG | Ceramics International | | | |
2016 | Microstructures, electrical and magnetic properties of (Ga, Co)-ZnO films by radio frequency magnetron co-sputtering | Chen, S.-C.; Wang, C.-H.; Sun, H.; Wen, C.-K.; Lu, C.-F.; Tsai, C.-L.; Fu, Y.-K.; Chuang, T.-H.; TUNG-HAN CHUANG | Surface and Coatings Technology | | | |
2008 | Model of hyperbranched polymers formed by monomers A2 and Bg with end-capping molecules | Cheng, K.-C.; Chuang, T.-H.; Tsai, T.-H.; Guo, W.; Su, W.-F.; WEI-FANG SU | European Polymer Journal | | | |
2003 | Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy | Chang, S.-Y.; Wang, S.-S.; Tsao, L.-C.; Chuang, T.-H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2020 | Nanostructure- And Orientation-Controlled Resistive Memory Behaviors of Carbohydrate- block-Polystyrene with Different Molecular Weights via Solvent Annealing | Chuang, T.-H.; Chiang, Y.-C.; Hsieh, H.-C.; Isono, T.; Huang, C.-W.; Borsali, R.; Satoh, T.; WEN-CHANG CHEN | ACS Applied Materials and Interfaces | 16 | 16 | |
2014 | Nickel-tin solid-liquid inter-diffusion bonding | Yu, C.-C.; Su, P.-C.; Bai, S.J.; Chuang, T.-H.; TUNG-HAN CHUANG | International Journal of Precision Engineering and Manufacturing | | | |
2007 | Observation of Fabry-P?rot-type surface plasmon on Ag film with perforated short-range 3×3 hole array arranged in long-range periodic structure | Chang, Y.-T.; Chuang, T.-H.; Tsai, M.-W.; Lai, M.-J.; SI-CHEN LEE | Applied Physics Letters | | | |
2017 | p-type cuprous oxide thin films with high conductivity deposited by high power impulse magnetron sputtering | Sun, H.; Chen, S.-C.; Wen, C.-K.; Chuang, T.-H.; Arab Pour Yazdi, M.; Sanchette, F.; Billard, A.; TUNG-HAN CHUANG | Ceramics International | | | |
2020 | p-type semi-transparent conductive NiO films with high deposition rate produced by superimposed high power impulse magnetron sputtering | Chuang, T.-H.; Wen, C.-K.; Chen, S.-C.; Liao, M.-H.; Liu, F.; Sun, H.; MING-HAN LIAO ; TUNG-HAN CHUANG | Ceramics International | | 10 | |
2006 | Rapid whisker growth on the surface of Sn-3Ag-0.5Cu-1.0Ce solder joints | Chuang, T.-H.; TUNG-HAN CHUANG | Scripta Materialia | | | |
2006 | Remotely coupled surface plasmons in a metal/insulator/Si structure perforated with periodic square hole arrays | Chuang, T.-H.; Tsai, M.-W.; Chang, Y.-T.; SI-CHEN LEE | Applied Physics Letters | 13 | 9 | |
2006 | Remotely coupled surface plasmons in a two-colored plasmonic thermal emitter | Chuang, T.-H.; Tsai, M.-W.; Chang, Y.-T.; SI-CHEN LEE | Applied Physics Letters | | | |
2006 | Selective particle separation and deposition by 3-D insulator-based dielectrophoresis | Chuang, K.-C.; Chu, L.-Y.; Jiang, M.-S.; Chuang, T.-H.; Fu, C.-C.; Fan, S.-K.; SHIH-KANG FAN | 10th International Conference on Miniaturized Systems for Chemistry and Life Sciences | | | |
2020 | Study on thermoelectric property optimization of mixed-phase bismuth telluride thin films deposited by co-evaporation process | Wu, Y.-J.; Hsu, S.-C.; Lin, Y.-C.; Xu, Y.; Chuang, T.-H.; Chen, S.-C.; TUNG-HAN CHUANG | Surface and Coatings Technology | | | |
2013 | Surface reconstruction of an annealing twinned Ag-8Au-3Pd alloy wire under current stressing | Chuang, T.-H.; Wang, H.-C.; Chuang, C.-H.; Lin, H.-J.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2009 | The proximity between C-termini of dimeric vacuolar H+- pyrophosphatase determined using atomic force microscopy and a gold nanoparticle technique | Liu, T.-H.; Hsu, S.-H.; Huang, Y.-T.; Lin, S.-M.; Huang, T.-W.; Chuang, T.-H.; Fan, S.-K.; Fu, C.-C.; Tseng, F.-G.; Pan, R.-L.; SHIH-KANG FAN | FEBS Journal | | | |