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  1. NTU Scholars
  2. Research Outputs

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0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Showing results 1 to 20 of 294  next >
Issue DateTitleAuthor(s)SourcescopusWOSFulltext/Archive link
2019Abnormal Cu3Sn growth through grain boundary penetration in space-confined Ni-Sn-Cu diffusion couplesWang Y.W.; Zhu Z.X.; Shih W.L.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds66
2023Additive-induced crystallization of highly (111) textured Cu nanotwins by electroless depositionShih, P. S.; Huang, C. H.; C. ROBERT KAO Journal of Alloys and Compounds1
2014Amorphous Pd layer as a highly effective oxidation barrier for surface finish of electronic terminalsLi C.C.; Shih W.L.; Chung C.K.; Kao C.R.; C. ROBERT KAO Corrosion Science76
2018Analyses and design for electrochemical migration suppression by alloying indium into silverYang C.A.; Wu J.; Lee C.C.; Kao C.R.; C. ROBERT KAO Journal of Materials Science: Materials in Electronics910
2011Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressingKe J.H.; Yang T.L.; Lai Y.S.; C. ROBERT KAO Acta Materialia5452
2008Analysis and experimental verification of the volume effect in the reaction between zn-doped solders and cuYang S.C.; Wang Y.W.; CHIEN-CHENG CHANG ; C. ROBERT KAO Journal of Electronic Materials1818
1994Application of Thermodynamics, Phase-Equilibria and Kinetics to in-Situ Composite Synthesis Via Ternary Solid-State Displacement-ReactionsChang, Ya; Kao, Cr; C. ROBERT KAO Pure and Applied Chemistry1614
2023Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion MillingChang, Fu Ling; Lin, Yu Hsin; Hung, Han Tang; Kao, Chen Wei; C. ROBERT KAO Materials00
2020Artifact-free microstructures of the Cu-In reaction by using cryogenic broad argon beam ion polishingHung H.T; Lee P.T; Tsai C.H; Kao C.R.; C. ROBERT KAO Journal of Materials Research and Technology76
2013Assembly of N type Bi2(Te, Se)3 thermoelectric modules by low temperature bondingLi C.C.; Zhu Z.X.; Liao L.L.; Dai M.J.; Liu C.K.; Kao C.R.; C. ROBERT KAO Science and Technology of Welding and Joining77
2013Au and Pd embrittlement in space-confined soldering reactions for 3D IC applicationsChen Y.J.; Huang K.Y.; Chen H.T.; Kao C.R.; C. ROBERT KAO International Symposium on Advanced Packaging Materials50
2016Au-Sn bonding material for the assembly of power integrated circuit moduleZhu Z.X.; Li C.C.; Liao L.L.; Liu C.K.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds8076
2022Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental CatalysisRenganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO Electroanalysis11
1999Binary compounds in the Ge-Ti systemJain T.A.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds1111
2018Bonding of copper pillars using electroless Au platingWeng I.A.; Hung H.T.; Yang S.; Chen Y.H.; Kao C.R.; C. ROBERT KAO 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference50
2019Bonding of Copper Pillars Using Electroless Cu PlatingKao L.Y.; Hung H.T.; Chen Y.H.; Kao C.R.; C. ROBERT KAO 2019 International Conference on Electronics Packaging70
2016Bonding of copper pillars using electroless Ni platingYang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO 2016 International Conference on Electronics Packaging30
1997Calculation of low-temperature phase equilibria in the indium-lead systemKao C.R.; C. ROBERT KAO Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an11
2003Chemical reaction in solder joints of microelectronic packagesHo C.E.; Lin Y.L.; Tsai J.Y.; Kao C.R.; C. ROBERT KAO Journal of the Chinese Institute of Chemical Engineers7
2017Chip-to-Chip Direct Interconnections by Using Controlled Flow Electroless Ni PlatingHung H.T.; Yang S.; Chen Y.B.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials2016
Showing results 1 to 20 of 294  next >

臺大位居世界頂尖大學之列,為永久珍藏及向國際展現本校豐碩的研究成果及學術能量,圖書館整合機構典藏(NTUR)與學術庫(AH)不同功能平台,成為臺大學術典藏NTU scholars。期能整合研究能量、促進交流合作、保存學術產出、推廣研究成果。

To permanently archive and promote researcher profiles and scholarly works, Library integrates the services of “NTU Repository” with “Academic Hub” to form NTU Scholars.

總館學科館員 (Main Library)
醫學圖書館學科館員 (Medical Library)
社會科學院辜振甫紀念圖書館學科館員 (Social Sciences Library)

開放取用是從使用者角度提升資訊取用性的社會運動,應用在學術研究上是透過將研究著作公開供使用者自由取閱,以促進學術傳播及因應期刊訂購費用逐年攀升。同時可加速研究發展、提升研究影響力,NTU Scholars即為本校的開放取用典藏(OA Archive)平台。(點選深入了解OA)

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  • 網站簡介 (Quickstart Guide)
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  • 方案一:臺灣大學計算機中心帳號登入
    (With C&INC Email Account)
  • 方案二:ORCID帳號登入 (With ORCID)
  • 方案一:定期更新ORCID者,以ID匯入 (Search for identifier (ORCID))
  • 方案二:自行建檔 (Default mode Submission)
  • 方案三:學科館員協助匯入 (Email worklist to subject librarians)
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