| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
|---|---|---|---|---|---|---|
| 2019 | Abnormal Cu3Sn growth through grain boundary penetration in space-confined Ni-Sn-Cu diffusion couples | Wang Y.W.; Zhu Z.X.; Shih W.L.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 0 | 0 | |
| 2014 | Amorphous Pd layer as a highly effective oxidation barrier for surface finish of electronic terminals | Li C.C.; Shih W.L.; Chung C.K.; Kao C.R.; C. ROBERT KAO | Corrosion Science | 3 | 3 | |
| 2018 | Analyses and design for electrochemical migration suppression by alloying indium into silver | Yang C.A.; Wu J.; Lee C.C.; Kao C.R.; C. ROBERT KAO | Journal of Materials Science: Materials in Electronics | 2 | 2 | |
| 2011 | Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing | Ke J.H.; Yang T.L.; Lai Y.S.; Kao C.R.; C. ROBERT KAO | Acta Materialia | 47 | 45 | |
| 2008 | Analysis and experimental verification of the volume effect in the reaction between zn-doped solders and cu | Yang S.C.; Wang Y.W.; Chang C.C.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 17 | 17 | |
| 1994 | Application of Thermodynamics, Phase-Equilibria and Kinetics to in-Situ Composite Synthesis Via Ternary Solid-State Displacement-Reactions | Chang, Ya; Kao, Cr; C. ROBERT KAO | Pure and Applied Chemistry | 16 | 14 | |
| 2013 | Assembly of N type Bi2(Te, Se)3 thermoelectric modules by low temperature bonding | Li C.C.; Zhu Z.X.; Liao L.L.; Dai M.J.; Liu C.K.; Kao C.R.; C. ROBERT KAO | Science and Technology of Welding and Joining | 6 | 6 | |
| 2013 | Au and Pd embrittlement in space-confined soldering reactions for 3D IC applications | Chen Y.J.; Huang K.Y.; Chen H.T.; Kao C.R.; C. ROBERT KAO | International Symposium on Advanced Packaging Materials | 5 | 0 | |
| 2016 | Au-Sn bonding material for the assembly of power integrated circuit module | Zhu Z.X.; Li C.C.; Liao L.L.; Liu C.K.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 55 | 57 | |
| 1999 | Binary compounds in the Ge-Ti system | Jain T.A.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 11 | 11 | |
| 2018 | Bonding of copper pillars using electroless Au plating | Weng I.A.; Hung H.T.; Yang S.; Chen Y.H.; Kao C.R.; C. ROBERT KAO | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference | 2 | 0 | |
| 2019 | Bonding of Copper Pillars Using Electroless Cu Plating | Kao L.Y.; Hung H.T.; Chen Y.H.; Kao C.R.; C. ROBERT KAO | 2019 International Conference on Electronics Packaging | 0 | 0 | |
| 2016 | Bonding of copper pillars using electroless Ni plating | Yang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO | 2016 International Conference on Electronics Packaging | 3 | 0 | |
| 1997 | Calculation of low-temperature phase equilibria in the indium-lead system | Kao C.R.; C. ROBERT KAO | Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an | 1 | 1 | |
| 2003 | Chemical reaction in solder joints of microelectronic packages | Ho C.E.; Lin Y.L.; Tsai J.Y.; Kao C.R.; C. ROBERT KAO | Journal of the Chinese Institute of Chemical Engineers | 7 | ||
| 2017 | Chip-to-Chip Direct Interconnections by Using Controlled Flow Electroless Ni Plating | Hung H.T.; Yang S.; Chen Y.B.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 7 | 5 | |
| 2016 | Choice of Intermetallic Compounds for Structural Applications in Near Submicron Joints | Yu J.J.; Wu J.Y.; Yu L.J.; Kao C.R.; C. ROBERT KAO | Electronic Components and Technology Conference | 1 | 0 | |
| 2011 | Consumption of Cu pad during multiple reflows of Ni-doped SnAgCu solder | Chang C.C.; Yang S.C.; Chen Y.J.; Kao C.R.; C. ROBERT KAO | International Journal of Materials Research | 0 | 1 | |
| 2017 | Contacts for PbTe | Li C.-C.; Kao C.R.; C. ROBERT KAO | Advanced Thermoelectrics: Materials, Contacts, Devices, and Systems | 1 | 0 | |
| 2005 | Controlling the microstructures from the gold-tin reaction | Tsai J.Y.; Chang C.W.; Shieh Y.C.; Hu Y.C.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 90 | 78 |
