公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
1997 | NC工具機加工精度與熱誤差之研究 | 楊宏智 | | | | |
2007 | Nonlinear penetrating behavior in high energy beam drilling | Ho, J.E.; Young, H.T.; HONG-TSU YOUNG | 35th International MATADOR 2007 Conference | | | |
2008 | Novel approach to fabrication of 3D micro-structures by laser machining | Young, H.-T.; Lin, F.-F.; Hong, S.-B.; HONG-TSU YOUNG | Key Engineering Materials | | | |
2007 | Novel Method to Investigate the Critical Depth of Cut of Ground Si Wafer | Young, H.T.; Liao, H.T.; HONG-TSU YOUNG | Journal of Material Processing Technology | | | |
2007 | Novel method to investigate the critical depth of cut of ground silicon wafer | Young, H.T.; Liao, H.-T.; Huang, H.-Y.; HONG-TSU YOUNG | Journal of Materials Processing Technology | | | |
2015 | A novel non-enzymatic electrochemical glucose biosensor based on a simple lithographic process | Hsu, C.-W.; Su, F.-C.; Peng, P.-Y.; Young, H.-T.; Yang, M.; Wang, G.-J.; HONG-TSU YOUNG | ASME Design Engineering Technical Conference | | | |
2015 | A Novel Non-Enzymatic Electrochemical Glucose Sensor Based on a Simple Lithographic Process | Hsu, C.W.; Su, F.C.; Peng, P.Y; Young, H.T.; Yang, Mike; Wang, G.J.; HONG-TSU YOUNG | ASME 2015 International Design Engineering Technical Conferences & Computers and Information in Engineering Conference (IDETC/CIE 2015) | | | |
1994 | On the analysis of chip temperature distribution in orthogonal machining | Young, H.T.; Liou, H.Y.; HONG-TSU YOUNG | International Journal of Machine Tools and Manufacture | | | |
2011 | Online condition-based shaft faults diagnosis with multiscale entropy | Pan, Y.-H.; Wang, C.; Lin, W.-Y.; Wang, Y.-H.; HONG-TSU YOUNG ; Lee, Kuo Tien | Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture | 5 | 4 | |
2006 | Online dressing of profile grinding wheels | Young, H.-T.; Chen, D.-J.; Young, H.T.; Chen, D.J.; HONG-TSU YOUNG | International Journal of Advanced Manufacturing Technology | | | |
2004 | Online Dressing of Profile Grinding Wheels | Young, H.T.; Chen, D.J.; YoungHT | International Journal of Advanced Manufacturing Technology | | | |
2009 | Oxidation of Stainless Steel Induced by Femtosecond and Nanosecond Laser Ablation: A Comparative Raman Study | Lin, F.F.; Young, H.T.; Wang, J.K.; HONG-TSU YOUNG | COLA 2009 Proceedings | | | |
2014 | Path Planning for Synchronization of Laser Galvanometric Scanner and Stage Motion System | Ding, C.F.; Tu, W.C.; Liu, Z.X.; Young, H.T.; HONG-TSU YOUNG | he 4th International Conference on Nanomanufacturing (nanoMan 2014) | | | |
2008 | Precision wafer thinning and its surface conditioning technique | Young, H.-T.; Lin, C.-C.; Liao, H.-T.; Yang, M.; Young, H T.; Lin, C C.; Liao, H T.; Yang, M.; HONG-TSU YOUNG | International Journal of Materials and Product Technology | | | |
1994 | Predicting cutting forces in face milling | Young, H.-T.; Mathew, P.; Oxley, P.L.B.; HONG-TSU YOUNG | International Journal of Machine Tools and Manufacture | | | |
1993 | Predicting the chip flow for nose radius tools under oblique machining conditions | Young, H.-T.; Liao, Y.-S.; Yang, Y.-C.; Mathew, P.; HONG-TSU YOUNG | Journal of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an | | | |
1999 | Project-management of diversified product design parameters for concurrent engineering | Kang, M.-Y.; Young, H.-T.; HONG-TSU YOUNG | Journal of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an | | | |
2005 | Quantitative reliability analysis of electronic packages in consideration of variability of model parameters | Wu, W.-F.; Lin, Y.-Y.; Young, H.-T.; HONG-TSU YOUNG | 7th Electronics Packaging Technology Conference | | | |
2019 | Real time monitoring of fs laser annealing on indium tin oxide | Wu, P.-H.; Hu, C.-L.; Feng, S.-W.; Young, H.-T.; Lu, M.-Y.; Wang, H.-C.; HONG-TSU YOUNG | Optics and Laser Technology | | | |
2014 | Real-time Lithium-ion Battery Internal Condition Estimation and Fault Detection | Liao, P.H.; Li, K.; Chang C.J.; Yong, H.T.; HONG-TSU YOUNG | 2014 IEEE International Conference on Automation Science and Engineering (CASE2014) | | | |