| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
| 2019 | Heat transfer and its innovative applications | Chen, P.-H.; Cho, H.H.; PING-HEI CHEN | Inventions | 0 | 0 | |
| 2005 | Heat transfer in a twin-blow narrow channel with two opposite walls roughened by skewed ribs arranged in staggered manner | Chang, S.W.; Chiang, K.F.; Yang, T.L.; Chen, P.H.; Chang, S.W.; Chiang, K.F.; Yang, T. L.; Chen, P.-H; PING-HEI CHEN ; Chang, S.W.; Chiang, K.F.; Yang, T. L.; Chen, P.-H | International Journal of Thermal Sciences | 3 | 4 | |
| 2002 | High performance flat miniature heat pipes fabricated by UD-LIGA process | CHENG, Y; DING, PP; SHEU, TS; et al.Cheng, Y; Ding, PP; Sheu, TS; Shew, BY; Chen, PH; PING-HEI CHEN ; Cheng, Y; Ding, PP; Sheu, TS; Shew, BY; Chen, PH | Microsystem Technologies | 4 | 3 | |
| 2008 | High power electronic component: Review | Chen, P.H.; Chang, S.W.; Chiang, K.F.; Li, J.; Chen, Ping H.; Chang, Shyy W.; Chiang, Kuei F.; Li, Ji; PING-HEI CHEN ; Chen, K-L.; Chen, Ping H.; Chang, Shyy W.; Hsieh, C-L.; Chiang, Kuei F.; Sheu, C-F.; Li, Ji; Hu, F-C.; Tseng, M-H. | Recent Patents on Engineering | 29 | 0 | |
| 2017 | A hybrid surface modification method on copper wire braids for enhancing thermal performance of ultra-thin heat pipes | Sheng, W.K.; Lin, H.T.; Wu, C.H.; Kuo, L.S.; Chen, P.H.; PING-HEI CHEN | IOP Conference Series: Materials Science and Engineering | 2 | 0 | |
| 2012 | Hybrid thermal solution for 3D-ICs: Using thermal TSVs with placement algorithm for stress relieving structures | Chien, J.-H.; Yu, H.; Tsai, N.-Y.; Lung, C.-L.; Hsu, C.-C.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN | Electronic Components and Technology Conference | 0 | 0 | |
| 2012 | Hybrid thermal solution for 3D-ICs: Using thermal TSVs with placement algorithm for stress relieving structures | Chien, J.-H.; Yu, H.; Tsai, N.-Y.; Lung, C.-L.; Hsu, C.-C.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN | Electronic Components and Technology Conference | 0 | 0 | |
| 2001 | Improved data reduction method for transient liquid crystal thermography on film cooling measurements | Chen, P.-H.; Ding, P.-P.; Ai, D.; PING-HEI CHEN | International Journal of Heat and Mass Transfer | 13 | 10 | |
| 2016 | Improvement of water wetting capability of copper wire braids by surface modification approaches | Hsu, C.-C.; Wu, C.-H.; Sheng, W.-K.; Chen, M.; Kuo, L.-S.; Chen, P.-H.; PING-HEI CHEN | International Communications in Heat and Mass Transfer | 1 | 2 | |
| 2011 | Improvement on thermal performance of a disk-shaped miniature heat pipe with nanofluid | Tsai, Tsung-Han; Chien, Hsin-Tang; Chen, Ping-Hei; Tsai, Tsung-Han; Chien, Hsin-Tang; Chen, Ping-Hei; Tsai, Tsung-Han; PING-HEI CHEN ; Chan, Ta-Chien; Chien, Hsin-Tang; Chen, Ping-Hei | Nanoscale Research Letters | 4 | 18 | |
| 2003 | Improvement on thermal performance of a disk-shaped miniature heat pipe with nanofluid | Chien, Hsin-Tang; Tsai, Chien-In; Chen, Ping-Hei ; Chen, Po-Yeh | Fifth International Conference on Electronic Packaging Technology Proceedings | 55 | 0 |  |
| 2003 | Improvement on thermal performance of a disk-shaped miniature heat pipe with nanofluid | Chien, H.-T.; Tsai, C.-I.; Chen, P.-H.; Chen, P.-Y.; PING-HEI CHEN | 5th International Conference on Electronic Packaging Technology | 55 | 0 | |
| 2004 | In situ monitoring of silicon membrane thickness during wet etching using a surface acoustic wave sensor | Lee, C.-Y.; Cheng, Y.-C.; Chen, Y.-Y.; Chang, P.-Z.; Wu, T.-T.; Chen, P.-H.; Chen, W.-J.; Pao, S.-Y.; PING-HEI CHEN | Japanese Journal of Applied Physics | 2 | 1 | |
| 2004 | In-situ Monitoring of Silicon Membrane Thickness during Wet Etching Using a SAW Sensor | Lee, Chi-Yuan; Cheng, Ying-Chou ; Wu, Tsung-Tsong ; Chen, Yung-Yu; Chen, Wen-Jong; Pao, Shih-Yung; Chang, Pei-Zen ; Chen, Ping-Hei | Japanese Journal of Applied Physics | | | |
| 2003 | In-situ monitoring of thickness of quartz membrane during batch chemical etching using a novel micromachined acoustic wave sensor | Lee, C.-Y.; PING-HEI CHENet al. | Annual IEEE International Frequency Control Symposium | | | |
| 2015 | Influence of surface temperature and wettability on droplet evaporation | PING-HEI CHEN; PING-HEI CHEN | Applied Physics Letters | 13 | 14 | |
| 2011 | Investigation of electrical and magnetic properties of ferro-nanofluid on transformers | Tsai, Tsung-Han; PING-HEI CHEN ; Chen, Ping-Hei; Lee, Da-Sheng; Chang, Shan-Chwen; Yang, Chin-Ting | Nanoscale Research Letters | 17 | 17 | |
| 2014 | A Lego?-like swappable fluidic module for bio-chem applications | Hsieh, Y.-F.; Yang, A.-S.; Chen, J.-W.; Liao, S.-K.; Su, T.-W.; Yeh, S.-H.; Chen, P.-J.; Chen, P.-H.; PING-HEI CHEN | Sensors and Actuators, B: Chemical | 14 | 15 | |
| 1990 | Local mass (heat) transfer distribution over the concave surface of a turbine blade | PING-HEI CHEN | Journal of the Chinese Society of Mechanical Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao | | | |
| 1996 | Mass transfer over a film-cooled turbine blade | PING-HEI CHEN | International Journal of Rotating Machinery | 0 | 0 | |
