公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2010 | The effect of 0.5 wt.% Ce additions on the electromigration of Sn9Zn BGA solder packages with Au/Ni(P)/Cu and Ag/Cu pads | Lin, Hsiu-Jen; Chuang, Tung-Han | Materials Letters | 9 | 8 | |
2009 | Effect of adding Ge on rapid whisker growth of Sn-3Ag-0.5Cu-0.5Ce alloy | Chuang, T.-H.; Chi, C.-C.; TUNG-HAN CHUANG | Journal of Alloys and Compounds | 25 | 20 | |
2011 | Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder | Chang, S.Y.; Jain, C.C.; Chuang, T.H.; Feng, L.P.; TUNG-HAN CHUANG | Materials & Design (1980-2015) | 116 | 98 | |
2019 | Effect of alloying Au on the microstructural, mechanical and electrical properties of Ag-based alloy wires | Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Lee, J.-D.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG | Journal of Materials Science: Materials in Electronics | 5 | 5 | |
2013 | Effect of annealing twins on electromigration in Ag-8Au-3Pd bonding wires | Chuang, T.-H.; Wang, H.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Journal of Electronic Materials | 17 | 15 | |
2018 | Effect of Au Addition on the Microstructure and Properties of Ag-4Pd Bonding Wires | Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | 1 | 1 | |
1999 | The effect of humidity on the erosive wear of 6063 Al alloy | Fang, C.-K.; Chuang, T.H.; TUNG-HAN CHUANG | Wear | 7 | 6 | |
2010 | Effect of La addition on the interfacial intermetallics and bonding strengths of Sn-58Bi solder joints with Au/Ni/Cu pads | Shiue, Yu-Yun; Chuang, Tung-Han | Journal of Alloys and Compounds | 49 | 44 | |
2021 | Effect of post-weld heat treatment on the solid-state diffusion bonding of 6061 aluminum alloy | Chen C.-H; Sun Y.-K; Lai Y.-C; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG | Applied Sciences (Switzerland) | 6 | 6 | |
2021 | Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina | Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG | Applied Sciences (Switzerland) | 0 | 0 | |
2012 | Effects of annealing twins on the grain growth and mechanical properties of Ag-8Au-3Pd bonding wires | Chuang, T.-H.; Tsai, C.-H.; Wang, H.-C.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Journal of Electronic Materials | 34 | 33 | |
1997 | Effects of applied pressure on the brazing of superplastic INCONEL718 superalloy | Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | 23 | 15 | |
2011 | Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder Joints | Chuang, Tung-Han ; Wu, Hsing-Fei | Journal of Electronic Materials | 41 | 38 | |
2010 | Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints | Lin, Hsiu-Jen; Chuang, Tung-Han | Journal of Electronic Materials | 14 | 9 | |
2010 | Effects of Ce and Zn additions on the microstructure and mechanical properties of Sn-3Ag-0.5Cu solder joints | Lin, Hsiu-Jen; Chuang, Tung-Han | Journal of Alloys and Compounds | 25 | 20 | |
2021 | Effects of Grain Size on the Ag Dissolution and Ion Migration of Ag-4Pd Alloy Wires | Lin Y.-C; Lee P.-I; Wu P.-C; Chen C.-H; Chuang T.-H.; TUNG-HAN CHUANG | Journal of Electronic Materials | 3 | 2 | |
2013 | Effects of la addition on microstructure and mechanical properties of SN-58BI solders joints with osp pads | Shiue, Y.Y.; Chuang, T.H.; TUNG-HAN CHUANG | Canadian Metallurgical Quarterly | 2 | 2 | |
2000 | Effects of microstructures on corrosion and stress corrosion behaviors of an Al-12.1 at.% Zn alloy | Yeh, M.S.; Tsao, L.C.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | 1 | 1 | |
1997 | Effects of post-weld heat treatments on the residual stress and mechanical properties of electron beam welded SAE 4130 steel plates | Huang, C.C.; Pan, Y.C.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | 33 | 32 | |
1997 | Effects of post-weld heat treatments on the residual stress and mechanical properties of laser beam welded SAE 4130 steel plates | Huang, C.C.; Chuang, T.H.; TUNG-HAN CHUANG | Materials and Manufacturing Processes | 9 | 9 | |