公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2008 | Fatigue life evaluation of ball grid array packages with Sn-Ag-Cu and rare-earth addition solder under cyclic bending test | Cheng, C.-Y.; Zhan, C.-J.; Chuang, T.-H.; TUNG-HAN CHUANG | 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008 | | | |
2021 | Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper | Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG | Advances in Materials Science and Engineering | | | |
2008 | Focused-Ion-Beam-Based Selective Closing and Opening of Anodic Alumina Nanochannels for the Growth of Nanowire Arrays Comprising Multiple Elements | Liu, Nai-Wei; Liu, Chih-Yi; Wang, Huai-Hsien; Hsu, Chen-Feng; Lai, Ming-Yu; Chuang, Tung-Han ; Wang, Yuh-Lin | Advanced Materials | 30 | | |
2013 | Formation and growth of intermetallics in an annealing-twinned Ag-8Au-3Pd wire bonding package during reliability tests | Chuang, T.-H.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
2023 | Formation of Cu Nanotwins on Silicon Carbide Wafers with Cr Adhesive Layer under Various Substrate Bias | Syafei, Devi Indrawati; Chiang, Meng Ting; TUNG-HAN CHUANG | Metals | 0 | | |
2022 | Formation of High Density ?111? Textured Nanotwins in Evaporated Ag Thin Films Through Post-Deposition Ion Bombardment | Lee P.-I; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
2008 | Formation of Whiskers and Hillocks on the Surface of Sn-6.6RE Alloys | Chuang, T.H.; Chi, C.C.; Lin, H.J.; ChuangTH | Metallurgical and Materials Transactions A | 8 | | |
1994 | Grain boundary melting of hafnium containing Ni<inf>3</inf>Al intermetallic compounds | Chang, T.T.; Chuang, T.H.; TUNG-HAN CHUANG | Scripta Metallurgica et Materiala | | | |
1991 | Grain boundary pest of boron- doped Niin3Al at 1200 ?C | Chuang, T. H.; Pan, Y. C.; Hsu, S. E.; ChuangTH | Metallurgical and Materials Transactions A | | | |
1991 | Grain boundary pest of boron- doped Niin3Al at 1200 °C | Chuang, T.H.; Pan, Y.C.; Hsu, S.E.; TUNG-HAN CHUANG | Metallurgical Transactions A | | | |
2021 | Grain growth and twin formation in a Ag-4Pd alloy ribbon after annealing treatments | Chen C.-H; Lai Y.-C; Chuang T.-H.; TUNG-HAN CHUANG | Journal of Alloys and Compounds | | | |
2023 | Growth of Cu nanotwinned films on surface activated SiC chips | Yang, Zi Hong; Chen, Yen Ting; TUNG-HAN CHUANG | Journal of Materials Science: Materials in Electronics | 1 | 0 | |
2013 | High performance Ag-Pd alloy wires for high frequency IC packages | Tsai, H.-H.; Chuang, T.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Lin, H.-J.; Chang, C.-C.; TUNG-HAN CHUANG | Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT | | | |
2002 | IC晶片散熱器微小通道的成型與接合 | 莊東漢 ; 陳炳輝; 曾乙修; 曹龍泉; 王宣勝; 張世穎; 張立信 | 材料科學與工程 | | | |
2014 | Improvement of bonding strength of a (Pb, Sn)Te-Cu contact manufactured in a low temperature SLID-bonding process | Chuang, T.-H.; Yeh, W.-T.; Chuang, C.-H.; Hwang, J.-D.; TUNG-HAN CHUANG | Journal of Alloys and Compounds | | | |
2024 | Improvement of Silver Sintered Die Bonding of SiC/DBC Power Modules through Backside Metallization with High Density (111) Orientation Ag Nanotwinned Films | TUNG-HAN CHUANG ; Chen, Yen Ting; Chen, Yin Hsuan; Chu, Chia Ching; CHAO-SUNG LIN | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
2020 | Improvement of Sn-3Ag-0.5Cu Soldered Joints Between Bi 0.5 Sb 1.5 Te 3 Thermoelectric Material and a Cu Electrode | Chuang, T.-H.; Hsu, S.-W.; Lin, Y.-C.; Yeh, W.-T.; Chen, C.-H.; Lee, P.-I.; Wu, P.-C.; Cheng, H.-P.; TUNG-HAN CHUANG | Journal of Electronic Materials | | 5 | |
2022 | Improvement of the Mechanical Properties of the Diffusion-Bonded 2024 Aluminum Alloy through Post-Weld Heat Treatments | Chiang, Meng Ting; Chiu, Kuan Yu; Wu, Po Ching; Chang, Shih Ying; Sun, Yu Kai; TUNG-HAN CHUANG | Metals | 1 | 1 | |
1994 | Inconel 718 之超塑性成形 | 莊東漢 ; 曹正文; Chuang, Tung-Han | 超塑性成形與擴張接合學術研討會論文集 | | | |
2015 | Influence of glass transition temperature of underfill on the stress behavior and reliability of microjoints within a chip stacking architecture | Chang, J.-Y.; Huang, S.-Y.; Lee, C.-C.; Chuang, T.-H.; Chang, T.-C.; TUNG-HAN CHUANG | Journal of Electronic Packaging, Transactions of the ASME | | | |