公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2013 | High performance Ag-Pd alloy wires for high frequency IC packages | Tsai, H.-H.; Chuang, T.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Lin, H.-J.; Chang, C.-C.; TUNG-HAN CHUANG | Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT | | | |
2002 | IC晶片散熱器微小通道的成型與接合 | 莊東漢 ; 陳炳輝; 曾乙修; 曹龍泉; 王宣勝; 張世穎; 張立信 | 材料科學與工程 | | | |
2014 | Improvement of bonding strength of a (Pb, Sn)Te-Cu contact manufactured in a low temperature SLID-bonding process | Chuang, T.-H.; Yeh, W.-T.; Chuang, C.-H.; Hwang, J.-D.; TUNG-HAN CHUANG | Journal of Alloys and Compounds | | | |
2024 | Improvement of Silver Sintered Die Bonding of SiC/DBC Power Modules through Backside Metallization with High Density (111) Orientation Ag Nanotwinned Films | TUNG-HAN CHUANG ; Chen, Yen Ting; Chen, Yin Hsuan; Chu, Chia Ching; CHAO-SUNG LIN | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
2020 | Improvement of Sn-3Ag-0.5Cu Soldered Joints Between Bi 0.5 Sb 1.5 Te 3 Thermoelectric Material and a Cu Electrode | Chuang, T.-H.; Hsu, S.-W.; Lin, Y.-C.; Yeh, W.-T.; Chen, C.-H.; Lee, P.-I.; Wu, P.-C.; Cheng, H.-P.; TUNG-HAN CHUANG | Journal of Electronic Materials | | 5 | |
2022 | Improvement of the Mechanical Properties of the Diffusion-Bonded 2024 Aluminum Alloy through Post-Weld Heat Treatments | Chiang, Meng Ting; Chiu, Kuan Yu; Wu, Po Ching; Chang, Shih Ying; Sun, Yu Kai; TUNG-HAN CHUANG | Metals | 1 | 1 | |
1994 | Inconel 718 之超塑性成形 | 莊東漢 ; 曹正文; Chuang, Tung-Han | 超塑性成形與擴張接合學術研討會論文集 | | | |
2015 | Influence of glass transition temperature of underfill on the stress behavior and reliability of microjoints within a chip stacking architecture | Chang, J.-Y.; Huang, S.-Y.; Lee, C.-C.; Chuang, T.-H.; Chang, T.-C.; TUNG-HAN CHUANG | Journal of Electronic Packaging, Transactions of the ASME | | | |
2018 | The influence of oxygen flow ratio on the optoelectronic properties of p-type Ni<inf>1-x</inf>O films deposited by ion beam assisted sputtering | Sun, H.; Chen, S.-C.; Peng, W.-C.; Wen, C.-K.; Wang, X.; Chuang, T.-H.; TUNG-HAN CHUANG | Coatings | | | |
1997 | Influence of zr addition on the corrosion behavior of the Ni<inf>3</inf>AI intermetallic compounds | Chang, T.-T.; Chuang, T.-H.; TUNG-HAN CHUANG | Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an | | | |
2011 | The Inhibition of Tin Whiskers on the Surface of Sn-8Zn-3Bi-0.5Ce Solders | Jain, C.C.; Chen, C.L.; Lai, H.J.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | 8 | 5 | |
2009 | Inhibition of whisker growth on the surface of Sn-3Ag-0.5Cu-0.5Ce solder alloyed with Zn | Chuang, T.-H.; Lin, H.-J.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2012 | An innovative annealing-twinned Ag-Au-Pd bonding wire for IC and LED packaging | Tsai, H.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Chang, C.-C.; Chuang, T.-H.; TUNG-HAN CHUANG | Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT | | | |
1997 | Interfacial characteristics for brazing of aluminum matrix composites with Al-12Si filler metals | Weng, W.P.; Chuang, T.H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2011 | Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish | Lin, Hsiu-Jen; TUNG-HAN CHUANG | Microelectronics Reliability | 12 | 10 | |
2002 | Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate | Chiang, M.J.; Chuang, T.H.; TUNG-HAN CHUANG | Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques | | | |
2000 | Interfacial reactions between In10Ag solders and Ag substrates | Liu, Y.M.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2000 | Interfacial reactions between liquid indium and Au-deposited substrates | Liu, Y.M.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
1999 | Interfacial Reactions between Liquid Indium and Nickel Substrate | Tseng, Y.H.; Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2000 | Interfacial reactions between liquid indium and silver substrates | Liu, Y.M.; Chen, Y.L.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |