公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2015 | Magnetic pinning effect in YBa2Cu3O7-d/Nd0.35Sr0.65MnO3 bilayer | Cheng, S.; Lin, J. ; TUNG-HAN CHUANG | 2015 IEEE International Magnetics Conference, INTERMAG 2015 | 0 | 0 | |
1990 | Magnetization study on grain-boundary precipitation in a Ni-8 at. % Sn alloy | Yao, Y.D.; Chen, Y.Y.; Li, T.J.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Applied Physics | | | |
2016 | Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced Packages | Tsai, C.-H.; Chuang, C.-H.; Tsai, H.-H.; Lee, J.-D.; Chang, D.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
2006 | Mechanical properties of intermetallic compounds on lead-free solder by moiré techniques | Tsai, I.; Wu, E.; Yen, S.F.; TUNG-HAN CHUANG | Journal of Electronic Materials | 19 | 17 | |
2014 | Mechanism of Electromigration in Ag-Alloy Bonding Wires with Different Pd and Au Content | Chuang, T.-H.; Lin, H.-J.; Wang, H.-C.; Chuang, C.-H.; Tsai, C.-H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2018 | Mechanism of the Electromigration in Ag-Pd Alloy Bonding Wires | Chuang, T.-H.; Chen, C.-H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2004 | Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates | Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F.; ChuangTH | Journal of Electronic Materials | | | |
2004 | Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactions | Chuang, T. H.; Huang, K. W.; Lin, W. H.; ChuangTH | Journal of Electronic Materials | | | |
2022 | Microstructure evolution and failure mechanism of electromigration in Ag-alloy bonding wire | Chen C.-H; Lee P.-I; TUNG-HAN CHUANG | Journal of Alloys and Compounds | 7 | 6 | |
2016 | Microstructures and optoelectronic properties of Cu<inf>x</inf>O films deposited by high-power impulse magnetron sputtering | Sun, H.; Wen, C.-K.; Chen, S.-C.; Chuang, T.-H.; Arab Pour Yazdi, M.; Sanchette, F.; Billard, A.; TUNG-HAN CHUANG | Journal of Alloys and Compounds | | | |
2017 | Microstructures and optoelectronic properties of nickel oxide films deposited by reactive magnetron sputtering at various working pressures of pure oxygen environment | Sun, H.; Chen, S.-C.; Hsu, S.-W.; Wen, C.-K.; Chuang, T.-H.; Wang, X.; TUNG-HAN CHUANG | Ceramics International | | | |
2016 | Microstructures, electrical and magnetic properties of (Ga, Co)-ZnO films by radio frequency magnetron co-sputtering | Chen, S.-C.; Wang, C.-H.; Sun, H.; Wen, C.-K.; Lu, C.-F.; Tsai, C.-L.; Fu, Y.-K.; Chuang, T.-H.; TUNG-HAN CHUANG | Surface and Coatings Technology | | | |
2002 | Morphology and growth kinetics of Ag<inf>3</inf>Sn during soldering reaction between liquid Sn and an Ag substrate | Su, T.L.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | | | |
2003 | Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy | Chang, S.-Y.; Wang, S.-S.; Tsao, L.-C.; Chuang, T.-H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
1986 | The morphology of discontinuous precipitation on the surface of NiIn and NiSn alloys | Chuang, T.H.; Fournelle, R.A.; Gust, W.; Predel, B.; TUNG-HAN CHUANG | Scripta Metallurgica | | | |
2011 | Morphology of the Tin Whiskers on the Surface of a Sn-3Ag-0.5Cu-0.5Nd Alloy | TUNG-HAN CHUANG ; Jain, Chao-Chi | Metallurgical and Materials Transactions A | 5 | 4 | |
1991 | The mutual effects of boron, zirconium and aluminium on grain boundary segregation in Ni<inf>3</inf>Al intermetallic compounds | Chuang, T.H.; TUNG-HAN CHUANG | Materials Science and Engineering A | | | |
2014 | Nickel-tin solid-liquid inter-diffusion bonding | Yu, C.-C.; Su, P.-C.; Bai, S.J.; Chuang, T.-H.; TUNG-HAN CHUANG | International Journal of Precision Engineering and Manufacturing | | | |
1988 | Nontraditional grain refinement through phase transformation in an Al-Zn alloy | Chuang, T.-W.; Chen, S.-J.; TUNG-HAN CHUANG | Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an | | | |
1982 | Observations of fracture surface chemistry on Cu-0.5 At. % Sb bicrystals | Chuang, T.H.; Gust, W.; Heldt, L.A.; Hintz, M.B.; Hofmann, S.; Lu?i?, R.; Predel, B.; TUNG-HAN CHUANG | Scripta Metallurgica | | | |