公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2015 | Modeling and Analysis of Bandwidth-Enhanced Multilayer 1-D EBG With Bandgap Aggregation for Power Noise Suppression | C.-K. Shen; C.-H. Chen; D.-H. Han; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 6 | 6 | |
2007 | Modeling noise coupling between package and PCB power/ground planes with an efficient 2-D FDTD/lumped element method | T.-K. Wang; S.-T. Chen; C.-W. Tsai; S.-M. Wu; J. J. Drewniak; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 30 | 22 | |
2019 | Modeling of radiated emission caused by coaxial-to-microstrip transition | Li, P.-J.; Chou, C.-C.; Wu, T.-L.; TZONG-LIN WU | Proceedings of the 2019 21st International Conference on Electromagnetics in Advanced Applications, ICEAA 2019 | 1 | 0 | |
2018 | Modularized prototype of 5G mmWave base station system at 38 GHz | L. H. Yen; TZONG-LIN WU ; Ssu-Hao Su; Che-Yao Fan; Fang-Hsien Chu; Fang-Yao Kuo; Hsin-Chia Lu; Shau-Gang Mao; Kun-You Lin; Tsung-Chieh Yen; Tzong-Lin Wu; HSIN-CHIA LU | IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) | 2 | 0 | |
2011 | Mold-based compartment shielding to mitigate the intra-system coupled noise on SiP modules | C.-Y. Hsiao; C.-H. Huang; C.-D. Wang; K.-H. Liao; C.-H. Shen; C.-C. Wang; T.-L. Wu; TZONG-LIN WU | IEEE. Int. Symp. Electromagn. Compat. | 17 | 0 | |
2002 | More analyses for the service performance of elevator group systems | Chang, K.-M.; Wu, T.-L.; TZONG-LIN WU | Systems Analysis Modelling Simulation | 0 | 0 | |
2011 | A new bandstop filter using artificial defected ground structures with compact size and low radiation | Hsu, Y.-H.; Tsai, C.-H.; Wu, T.-L.; TZONG-LIN WU | 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010 | 1 | 0 | |
2006 | New package scheme of a 2.5Gb/s plastic tranceiver module employing mutiwall nanotubes for low electromagnetic interference | C.-M. Chang; J.-C. Chiu; W.-S. Jou; W.-H. Cheng; TZONG-LIN WU | IEEE Journal on Selected Topics in Quantum Electronics | 18 | 6 | |
2010 | Noise coupling mitigation in PWR/GND plane pair by means of photonic crystal fence: sensitivity analysis and design parameters extraction | A. Ciccomancini; T. L. Wu; A. Orl; i; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 16 | 15 | |
2019 | Novel Absorptive Balanced Bandpass Filters Using Resistive Loaded Transmission Lines | Lin, T.-Y.; Huang, Y.-C.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 14 | 15 | |
2017 | A Novel Absorptive Common-Mode Filter for Cable Radiation Reduction | P.-J. Li; Y.-C. Tseng; C.-H. Cheng; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 29 | 27 | |
2016 | Novel Absorptive Design of Common-Mode Filter at Desired Frequency Band | P.-J. Li; C.-H. Cheng; Y.-C. Tseng; T.-L. Wu; TZONG-LIN WU | IEEE 20th Workshop on Signal and Power Integrity (SPI) | 4 | 0 | |
2022 | A Novel Absorptive Power Delivery Network for Power Noise Mitigation | Huang L; Cheng C; Chen S; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 1 | 1 | |
2017 | A Novel and Compact Eight-Port Forward-Wave Directional Coupler With Arbitrary Coupling Level Design Using Four-Mode Control Technology | H.-L. Ting; S.-K. Hsu; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 23 | 24 | |
2008 | A novel broadband common-mode filter for high-speed differential signals | Liu, W.-T.; Han, T.-W.; Wu, T.-L.; TZONG-LIN WU | 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008 | 5 | 0 | |
2020 | A Novel Circuit Architecture of Bidirectional Common-Mode Noise Absorption Circuit | Li, P.-J.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 11 | 12 | |
2014 | A novel compact balun using a weakly coupled line with grounded resonator | Tsai, C.-H.; Chen, H.-C.; Wu, T.-L.; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 8 | 5 | |
2024 | A Novel Compact Dual-Functional Circuit with Differential-Mode Equalization and Broadband Common-Mode Suppression Using Patterned Ground Plane | Chen, Yu Ren; Lin, Yi Ting; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
2022 | A Novel Compact Single-Stage Absorption Common-Mode Filter | Liu H; Cheng C; Li P; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 11 | 8 | |
2012 | Novel crosstalk modeling for multiple through-silicon-vias (TSV) on 3-D IC: Experimental validation and application to Faraday cage design | Chang, Y.-J.; Chuang, H.-H.; Lu, Y.-C.; Chiou, Y.-P.; Wu, T.-L.; Chen, P.-S.; Wu, S.-H.; Kuo, T.-Y.; Zhan, C.-J.; Lo, W.-C.; YI-CHANG LU ; TZONG-LIN WU ; YIH-PENG CHIOU | 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012 | 22 | 0 | |