公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2013 | Test generation of path delay faults induced by defects in power TSV | Shih, C.-J.; Hsieh, S.-A.; Lu, Y.-C.; Li, J.C.-M.; Wu, T.-L.; TZONG-LIN WU ; YI-CHANG LU ; CHIEN-MO LI | Proceedings of the Asian Test Symposium | 2 | 0 | |
2001 | The bridging effect of the isolation moat on the EMI caused by ground bounce noise between power/ground planes of PCB | J.-N. Hwang; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 14 | | |
2001 | The effect of test system impedance on measurements of ground bounce in printed circuit boards | T.-L. Wu; Y.-H. Lin; J.-N. Huang; J.-J. Lin; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 7 | 6 | |
2013 | The effect of various skew compensation strategies on mode conversion and radiation from high-speed connectors | H.-C. Chen; S. Connor; T.-L. Wu; B. Archambeault; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 12 | 0 | |
2008 | The effects on SI and EMI for differential coupled microstrip lines over LPC-EBG power/ground planes | C.-H. Shih; G.-H. Shiue; T.-L. Wu; R.-B. Wu; TZONG-LIN WU ; RUEY-BEEI WU | Asia-Pacific Symp. Electromagn. Compat. | 7 | 0 | |
2002 | The influence of fiber orientation on electromagnetic shielding in liquid crystal polymers | W.-S. Jou; S.-K. Chiu; W.-H. Cheng; TZONG-LIN WU | Journal of Electronic Materials | 42 | 30 | |
2006 | Theoretical demonstration of enhancement of light extraction of flip-chip GaN light-emitting diodes with photonic crystals | C.-H. Chao; S. L. Chuang; T.-L. Wu; TZONG-LIN WU | Applied Physics Letters | 52 | 43 | |
2000 | Three-Dimensional Electromagnetic Modeling of Fiber-Core Effects on the Coupling Characteristics of Weakly Fused Tapered Fiber-Optic Couplers | Wu, T.-L.; TZONG-LIN WU | Journal of Lightwave Technology | 13 | 8 | |
1995 | Three-dimensional modeling of fused biconical optical fiber coupling devices | H.-C. Chang; T.-L. Wu; C.-W. Wu; TZONG-LIN WU | Progress in Electromagn. Research Symp. | | | |
2003 | Time-domain SPICE model for coupled interconnects using the multi-conductor layer peeling technique | C.-C. Kuo; T.-L. Wu; TZONG-LIN WU | Int. Zurich Symp. Technical Exhibit. Electromagn. Compat. | | | |
2015 | Transmission-Line Based Modeling for Conformal Shielding in Advanced System-in-Package (SiP) | C.-H. Chen; Y.-C. Tseng; I-C. Lin; C.-C. Fu; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | 9 | 0 | |
2015 | Tri-Section Quarter Wavelength Resonator Common Mode Filter | C.-Y. Lin; Y.-C. Huang; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Int. Symp. Electronmagn. Compat. | 5 | 0 | |
0 | Tzong-Lin Wu, Hao-Hsiang Chuang | TZONG-LIN WU | | | | |
2009 | An ultra compact electromagnetic band gap filter for GHz power noise suppression using LTCC technology | Huang, Y.-W.; Wang, T.-K.; Wu, T.-L.; TZONG-LIN WU | 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09 | 0 | 0 | |
2016 | An Ultracompact TSV-Based Common-Mode Filter (TSV-CMF) in Three-Dimensional Integrated Circuits (3-D ICs) | C.-H. Cheng; T.-L. Wu; TZONG-LIN WU | IIEEE Transactions on Electromagnetic Compatibility | 27 | 27 | |
2018 | Ultracompact Via-Based Absorptive Frequency-Selective Surface for 5-GHz Wi-Fi With Passbands and High-Performance Stability | C. W. Lin; C. K. Shen; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 15 | 14 | |
2021 | An Ultrawideband Common-Mode Filter with Cascaded Mushroom-like Structures | Chien Y.-C; Liu H.-W; TZONG-LIN WU | 2021 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2021 | 0 | 0 | |
1999 | Vectorial analysis for polarization effect of wavelength-flattened fiber-optic couplers | T.-L. Wu; TZONG-LIN WU | Microwave and Optical Technology Letters | 4 | | |
1997 | Vectorial analysis of fiber-core effects in weakly fused couplers | T.-L. Wu; TZONG-LIN WU | IEEE Photonics Technology Letters (SCI) | 5 | 4 | |
2022 | Vertically Polarized Planar Transition for Hollow-Dielectric-Waveguide-Based 5G/6G High-Speed mm-Wave Interconnect | Liu, Chung Yuan; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 0 | 0 | |