| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
| 2016 | Choice of Intermetallic Compounds for Structural Applications in Near Submicron Joints | Yu J.J.; Wu J.Y.; Yu L.J.; Kao C.R.; C. ROBERT KAO | Electronic Components and Technology Conference | 3 | 0 | |
| 2011 | Consumption of Cu pad during multiple reflows of Ni-doped SnAgCu solder | Chang, C. C.; Yang, S. C.; Chen, Y. J.; C. ROBERT KAO ; CHIEN-CHENG CHANG | International Journal of Materials Research | 0 | 1 | |
| 2017 | Contacts for PbTe | Li C.-C.; Kao C.R.; C. ROBERT KAO | Advanced Thermoelectrics: Materials, Contacts, Devices, and Systems | 0 | 0 | |
| 2005 | Controlling the microstructures from the gold-tin reaction | Tsai J.Y.; Chang C.W.; Shieh Y.C.; Hu Y.C.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 107 | 81 | |
| 2021 | Copper sulfide nano-globules reinforced electrodes for high-performance electrochemical determination of toxic pollutant hydroquinone | Maheshwaran S; Balaji R; Chen S.-M; Biswadeep R; Renganathan V; Narendhar C; Kao C.R.; C. ROBERT KAO | New Journal of Chemistry | 13 | 10 | |
| 2019 | Creep Behaviors Along Characteristic Crystal Orientations of Sn and Sn-1.8Ag by Using Nanoindentation | Chiang P.J.; Wu J.Y.; Yu H.Y.; Kao C.R.; C. ROBERT KAO | JOM | 7 | 7 | |
| 2018 | Creep mechanism in characteristic orientation of Sn and Sn-1.8Ag by nanoindentation | Chiang P.J.; Wu J.Y.; Liao Y.C.; Kao C.R.; C. ROBERT KAO | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference | 0 | 0 | |
| 2012 | Critical concerns in soldering reactions arising from space confinement in 3-D IC packages | Chuang H.Y.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; Li C.C.; C. ROBERT KAO ; C. ROBERT KAO | IEEE Transactions on Device and Materials Reliability | 82 | 72 | |
| 2017 | Critical Factors Affecting Structural Transformations in 3D IC Micro Joints | Yang H.W.; Yu H.Y.; Kao C.R.; C. ROBERT KAO | Electronic Components and Technology Conference | 5 | 0 | |
| 2011 | Critical new issues relating to interfacial reactions arising from low solder volume in 3D IC packaging | Chuang H.Y.; Chen W.M.; Shih W.L.; Lai Y.S.; Kao C.R.; C. ROBERT KAO | Electronic Components and Technology Conference | 18 | 0 | |
| 2012 | The critical oxide thickness for Pb-free reflow soldering on Cu substrate | Chung, C.Key; Chen, Y.J.; Li, C.C.; C. ROBERT KAO | Thin Solid Films | 26 | 23 |  |
| 2006 | Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples | Chang C.W.; Lee Q.P.; Ho C.E.; C. ROBERT KAO ; C. ROBERT KAO | Journal of Electronic Materials | 24 | 23 | |
| 2010 | Cross-interaction between Ni and Cu across a high-lead solder joint with different solder volume | Chang C.C.; Kao C.R.; C. ROBERT KAO | International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference | 0 | 0 | |
| 2007 | Cross-Interaction between Ni and Cu across Sn Layers with Different Thickness | Chang, Chien Wei; Yang, Su Chun; Tu, Chun-Te; Kao, C. Robert | Journal of Electronic Materials | | |  |
| 2007 | Cross-interaction between Ni and Cu across Sn layers with different thickness | Chang, C.W.; Yang, S.C.; Tu, C.-T.; Kao, C.R.; C. ROBERT KAO | Journal of Electronic Materials | 65 | 57 | |
| 2004 | Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints | Tsai C.M.; Luo W.C.; Chang C.W.; Shieh Y.C.; C. ROBERT KAO | Journal of Electronic Materials | 63 | 57 | |
| 2013 | Cu(TiWNx) film as a barrierless buffer layer for metallization applications | Lin C.-H.; Chuang H.-Y.; Kao C.R.; C. ROBERT KAO | Japanese Journal of Applied Physics | 8 | 8 | |
| 2020 | The demonstration of carbon nanotubes (CNTs) as flip-chip connections in 3-D integrated circuits with an ultralow connection resistance | Liao, M.-H.; Lu, P.-Y.; Su, W.-J.; Chen, S.-C.; Hung, H.-T.; Kao, C.-R.; Pu, W.-C.; Chen, C.-C.A.; Lee, M.-H.; MING-HAN LIAO ; WEI-JIUN SU ; C. ROBERT KAO | IEEE Transactions on Electron Devices | 5 | 6 | |
| 2022 | Development of Ag–In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices | Tsai C.-H; Huang W.-C; C. ROBERT KAO | Materials | 4 | 2 | |
| 2022 | Development of Cu-Cu Side-by-Side Interconnection Using Controlled Electroless Cu Plating | Chen, Y. A.; Shih, P. S.; Chang, F. L.; Grafner, S. J.; Huang, J. H.; Huang, C. H.; C. ROBERT KAO ; Lin, Y. S.; Hung, Y. C.; Kao, C. L.; Tarng, D. | Proceedings - Electronic Components and Technology Conference | 2 | | |
