| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
| 2022 | Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental Catalysis | Renganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO | Electroanalysis | 1 | 1 | |
| 1999 | Binary compounds in the Ge-Ti system | Jain T.A.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 11 | 11 | |
| 2018 | Bonding of copper pillars using electroless Au plating | Weng I.A.; Hung H.T.; Yang S.; Chen Y.H.; Kao C.R.; C. ROBERT KAO | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference | 6 | 0 | |
| 2019 | Bonding of Copper Pillars Using Electroless Cu Plating | Kao L.Y.; Hung H.T.; Chen Y.H.; Kao C.R.; C. ROBERT KAO | 2019 International Conference on Electronics Packaging | 7 | 0 | |
| 2016 | Bonding of copper pillars using electroless Ni plating | Yang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO | 2016 International Conference on Electronics Packaging | 4 | 0 | |
| 1997 | Calculation of low-temperature phase equilibria in the indium-lead system | Kao C.R.; C. ROBERT KAO | Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an | 1 | 1 | |
| 2003 | Chemical reaction in solder joints of microelectronic packages | Ho C.E.; Lin Y.L.; Tsai J.Y.; Kao C.R.; C. ROBERT KAO | Journal of the Chinese Institute of Chemical Engineers | 7 | | |
| 2017 | Chip-to-Chip Direct Interconnections by Using Controlled Flow Electroless Ni Plating | Hung H.T.; Yang S.; Chen Y.B.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 21 | 20 | |
| 2016 | Choice of Intermetallic Compounds for Structural Applications in Near Submicron Joints | Yu J.J.; Wu J.Y.; Yu L.J.; Kao C.R.; C. ROBERT KAO | Electronic Components and Technology Conference | 3 | 0 | |
| 2011 | Consumption of Cu pad during multiple reflows of Ni-doped SnAgCu solder | Chang, C. C.; Yang, S. C.; Chen, Y. J.; C. ROBERT KAO ; CHIEN-CHENG CHANG | International Journal of Materials Research | 0 | 1 | |
| 2017 | Contacts for PbTe | Li C.-C.; Kao C.R.; C. ROBERT KAO | Advanced Thermoelectrics: Materials, Contacts, Devices, and Systems | 0 | 0 | |
| 2005 | Controlling the microstructures from the gold-tin reaction | Tsai J.Y.; Chang C.W.; Shieh Y.C.; Hu Y.C.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 107 | 81 | |
| 2021 | Copper sulfide nano-globules reinforced electrodes for high-performance electrochemical determination of toxic pollutant hydroquinone | Maheshwaran S; Balaji R; Chen S.-M; Biswadeep R; Renganathan V; Narendhar C; Kao C.R.; C. ROBERT KAO | New Journal of Chemistry | 13 | 10 | |
| 2019 | Creep Behaviors Along Characteristic Crystal Orientations of Sn and Sn-1.8Ag by Using Nanoindentation | Chiang P.J.; Wu J.Y.; Yu H.Y.; Kao C.R.; C. ROBERT KAO | JOM | 7 | 7 | |
| 2018 | Creep mechanism in characteristic orientation of Sn and Sn-1.8Ag by nanoindentation | Chiang P.J.; Wu J.Y.; Liao Y.C.; Kao C.R.; C. ROBERT KAO | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference | 0 | 0 | |
| 2012 | Critical concerns in soldering reactions arising from space confinement in 3-D IC packages | Chuang H.Y.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; Li C.C.; C. ROBERT KAO ; C. ROBERT KAO | IEEE Transactions on Device and Materials Reliability | 82 | 72 | |
| 2017 | Critical Factors Affecting Structural Transformations in 3D IC Micro Joints | Yang H.W.; Yu H.Y.; Kao C.R.; C. ROBERT KAO | Electronic Components and Technology Conference | 5 | 0 | |
| 2011 | Critical new issues relating to interfacial reactions arising from low solder volume in 3D IC packaging | Chuang H.Y.; Chen W.M.; Shih W.L.; Lai Y.S.; Kao C.R.; C. ROBERT KAO | Electronic Components and Technology Conference | 18 | 0 | |
| 2012 | The critical oxide thickness for Pb-free reflow soldering on Cu substrate | Chung, C.Key; Chen, Y.J.; Li, C.C.; C. ROBERT KAO | Thin Solid Films | 26 | 23 |  |
| 2006 | Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples | Chang C.W.; Lee Q.P.; Ho C.E.; C. ROBERT KAO ; C. ROBERT KAO | Journal of Electronic Materials | 24 | 23 | |
