| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
| 2020 | The demonstration of carbon nanotubes (CNTs) as flip-chip connections in 3-D integrated circuits with an ultralow connection resistance | Liao, M.-H.; Lu, P.-Y.; Su, W.-J.; Chen, S.-C.; Hung, H.-T.; Kao, C.-R.; Pu, W.-C.; Chen, C.-C.A.; Lee, M.-H.; MING-HAN LIAO ; WEI-JIUN SU ; C. ROBERT KAO | IEEE Transactions on Electron Devices | 5 | 6 | |
| 2022 | Development of Ag–In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices | Tsai C.-H; Huang W.-C; C. ROBERT KAO | Materials | 4 | 2 | |
| 2022 | Development of Cu-Cu Side-by-Side Interconnection Using Controlled Electroless Cu Plating | Chen, Y. A.; Shih, P. S.; Chang, F. L.; Grafner, S. J.; Huang, J. H.; Huang, C. H.; C. ROBERT KAO ; Lin, Y. S.; Hung, Y. C.; Kao, C. L.; Tarng, D. | Proceedings - Electronic Components and Technology Conference | 2 | | |
| 2017 | Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver Joint | Yang C.A.; Kao C.R.; Nishikawa H.; C. ROBERT KAO | Electronic Components and Technology Conference | 15 | 0 | |
| 2022 | Development of high copper concentration, low operating temperature, and environmentally friendly electroless copper plating using a copper ‐ glycerin complex solution | Huang J.H; Shih P.S; Renganathan V; Grӓfner S.J; Chen Y.A; Huang C.H; Kao C.L; Lin Y.S; Hung Y.C; C. ROBERT KAO | Electrochimica Acta | 8 | 5 | |
| 2015 | Development of interconnection materials for Bi2Te3 and PbTe thermoelectric module by using SLID technique | Li C.C.; Hsu S.J.; Lee C.C.; Liao L.L.; Dai M.J.; Liu C.K.; Zhu Z.X.; Yang H.W.; Ke J.H.; Kao C.R.; Snyder G.J.; C. ROBERT KAO | Electronic Components and Technology Conference | 2 | 0 | |
| 2009 | Development of lead-free solders with superior drop test reliability performance | Wang Y.W.; Kao C.R.; C. ROBERT KAO | 2009 International Conference on Electronic Packaging Technology and High Density Packaging | 6 | 0 | |
| 2018 | Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Process | Yang S.; Hung H.-T.; Nishikawa H.; Kao C.R.; C. ROBERT KAO | Electronic Components and Technology Conference | 6 | 0 | |
| 2020 | Different interfacial structures of Cu/In obtained by surface activated bonding (SAB) in vacuum and vapor-assisted vacuum ultraviolet (V-VUV) at atmospheric pressure | Chiu, Y.S.; Kao, C.R.; Shigetou, A.; C. ROBERT KAO | Materials and Design | 0 | 0 | |
| 1995 | Diffusional behavior in B2 intermetallic compounds | Kao C.R.; Kim S.; Chang Y.A.; C. ROBERT KAO | Materials Science and Engineering A | 27 | 23 | |
| 2010 | Direct evidence for a Cu-enriched region at the boundary between Cu6Sn5 and Cu3Sn during Cu/Sn reaction | Chung, C.Key; Duh, Jenq-Gong; C. ROBERT KAO | Scripta Materialia | 46 | 43 |  |
| 2007 | Dissolution and interfacial reaction between Cu and Sn-Ag-Cu solders | Chang C.C.; Kao C.R.; C. ROBERT KAO | 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference | 6 | 0 | |
| 2015 | Dominant effects of Sn orientation on serrated cathode dissolution and resulting failure in actual solder joints under electromigration | Yang T.L.; Yu J.J.; Li C.C.; Lin Y.F.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 40 | 39 | |
| 2015 | Effect of Ag concentration on Ni/Sn-xAg/Ni micro joints under space confinement | Yu J.J.; Wu J.Y.; Yang S.; Kao C.R.; C. ROBERT KAO | 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference | 1 | 0 | |
| 2019 | Effect of Ag concentration on small solder volume Ni/SnAg/Ni system | Yu J.J.; Yang S.; Chung C.K.; Kao C.R.; C. ROBERT KAO | 13th Electronic Circuits World Convention: Connecting the World | 0 | | |
| 2002 | Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders | Chen W.T.; Ho C.E.; Kao C.R.; C. ROBERT KAO | Journal of Materials Research | 213 | 192 | |
| 2002 | Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni | Ho C.E.; Tsai R.Y.; Lin Y.L.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 315 | 279 | |
| 2010 | Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni | Yang, S.C.; Chang, C.C.; Tsai, M.H.; C. ROBERT KAO ; CHIEN-CHENG CHANG | Journal of Alloys and Compounds | 49 | 43 | |
| 2008 | Effect of multiple reflow cycles on ball impact responses of sn-4ag-0.5cu solder joints with immersion tin substrate pad finish | Lail Y.-S.; Kao C.R.; Chang H.-C.; Lee S.-H.; Kao C.-L.; Lan W.-H.; C. ROBERT KAO | 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference | 1 | 0 | |
| 2009 | Effect of multiple reflow cycles on ball impact responses of SnAgCu solder joints | Lai Y.; Chang H.; Kao C.; Kao C.R.; C. ROBERT KAO | Soldering & Surface Mount Technology | 1 | 2 | |
