| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
| 2015 | Effect of Ag concentration on Ni/Sn-xAg/Ni micro joints under space confinement | Yu J.J.; Wu J.Y.; Yang S.; Kao C.R.; C. ROBERT KAO | 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference | 1 | 0 | |
| 2019 | Effect of Ag concentration on small solder volume Ni/SnAg/Ni system | Yu J.J.; Yang S.; Chung C.K.; Kao C.R.; C. ROBERT KAO | 13th Electronic Circuits World Convention: Connecting the World | 0 | | |
| 2002 | Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders | Chen W.T.; Ho C.E.; Kao C.R.; C. ROBERT KAO | Journal of Materials Research | 213 | 192 | |
| 2002 | Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni | Ho C.E.; Tsai R.Y.; Lin Y.L.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 315 | 279 | |
| 2010 | Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni | Yang, S.C.; Chang, C.C.; Tsai, M.H.; C. ROBERT KAO ; CHIEN-CHENG CHANG | Journal of Alloys and Compounds | 49 | 43 |  |
| 2008 | Effect of multiple reflow cycles on ball impact responses of sn-4ag-0.5cu solder joints with immersion tin substrate pad finish | Lail Y.-S.; Kao C.R.; Chang H.-C.; Lee S.-H.; Kao C.-L.; Lan W.-H.; C. ROBERT KAO | 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference | 1 | 0 | |
| 2009 | Effect of multiple reflow cycles on ball impact responses of SnAgCu solder joints | Lai Y.; Chang H.; Kao C.; Kao C.R.; C. ROBERT KAO | Soldering & Surface Mount Technology | 1 | 2 | |
| 2002 | The effect of Ni on the interfacial reaction between Sn-Ag solder and Cu metallization | Tsai J.Y.; Kao C.R.; C. ROBERT KAO | 4th International Symposium on Electronic Materials and Packaging | 11 | 0 | |
| 2009 | Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate | Tsai M.H.; Lin Y.W.; Chuang H.Y.; Kao C.R.; C. ROBERT KAO | Journal of Materials Research | 10 | 9 | |
| 2006 | Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration | Lin Y.L.; Lai Y.S.; Tsai C.M.; C. ROBERT KAO | Journal of Electronic Materials | 31 | 27 | |
| 2008 | Effect of UBM thickness on the mean time to failure of flip-chip solder joints under electromigration | Lin Y.L.; Lai Y.S.; Lin Y.W.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 23 | 17 | |
| 2007 | Effect of Zn addition on the interfacial reactions between Cu and lead-free solders | Yang S.-C.; Ho C.-E.; Chang C.-W.; Kao C.R.; C. ROBERT KAO | Materials Research Society Symposium | 1 | | |
| 2013 | Effects of Ag concentration on the Ni-Sn interfacial reaction for 3D-IC applications | Yu J.J.; Chung C.K.; Yang S.; Kao C.R.; C. ROBERT KAO | International Symposium on Advanced Packaging Materials | 1 | 0 | |
| 2019 | Effects of Aspect Ratio on Microstructural Evolution of Ni/Sn/Ni Microjoints | Yang T.H.; Yu H.Y.; Wang Y.W.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 12 | 10 | |
| 2009 | Effects of Cu content on the dissolution rate of Cu for real solder joint during reflow soldering | Chang C.-C.; Kao C.R.; C. ROBERT KAO | IMPACT Conference 2009 International 3D IC Conference | 1 | 0 | |
| 2020 | Effects of Isothermal Heat Treatment on Microstructure Evolution of Microfluidic Electroless Ni-P Interconnection Structure | Hung H.T; Yang S; Shih P.S; Ma Z.D; Huang J.H; Kao C.R.; C. ROBERT KAO | Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT | 1 | 0 | |
| 2011 | Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints | Liu, Chao Sheng; Ho, Cheng En; Peng, Cheng Sam; C. ROBERT KAO | Journal of electronic materials | 32 | 28 | |
| 2006 | Effects of limited Cu supply on soldering reactions between SnAgCu and Ni | Ho C.E.; Lin Y.W.; Yang S.C.; Kao C.R.; C. ROBERT KAO ; C. ROBERT KAO | Journal of Electronic Materials | 137 | 116 | |
| 2009 | Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu | Wang Y.W.; Lin Y.W.; Tu C.T.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 170 | 149 | |
| 2007 | The effects of minor Fe, Co, and Ni additions to lead-free solders on the thickness of Cu3Sn at the interface | Wang Y.W.; Kao C.R.; C. ROBERT KAO | 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference | 5 | 0 | |
