| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
| 2017 | Fast Atom Beam- and Vacuum-Ultraviolet-Activated Sites for Low-Temperature Hybrid Integration | Yang H.-W.; Kao C.R.; Shigetou A.; C. ROBERT KAO | Langmuir | 12 | 8 | |
| 2022 | Fine-Pitch 30 μm Cu-Cu Bonding by Using Low Temperature Microfluidic Electroless Interconnection | YUNG-SHENG LIN; Hung, Yun Ching; Kao, Chin Li; Lai, Chung Hung; Shih, Po Shao; Huang, Jeng Hau; Tarng, David; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 2 | 0 | |
| 2022 | Flow in a microchannel filled with arrays of numerous pillars | Gräfner, S. J.; Wu, P. Y.; C. ROBERT KAO | International Journal of Heat and Fluid Flow | 2 | 0 | |
| 2020 | Foldable Kirigami Paper Electronics | Yang T.H; Hida H; Ichige D; Mizuno J; Robert Kao C; Shintake J.; C. ROBERT KAO | Physica Status Solidi (A) Applications and Materials Science | 5 | 7 | |
| 2002 | Foreword | Chada S.; Frear D.; Jin S.; Kang S.K.; C. ROBERT KAO ; Weiser, Martin | Journal of Electronic Materials | 4 | 1 | |
| 2003 | Foreword | Chen S.-W.; Lee H.M.; Swenson D.; C. ROBERT KAO ; Mohney S.E.; Notis M.R. | Journal of Electronic Materials | 0 | 0 | |
| 2001 | Foreword | Kang S.K.; Mavoori H.; Chada S.; C. ROBERT KAO ; Smith R.W. | Journal of Electronic Materials | 10 | 6 | |
| 1999 | Formation and absence of intermetallic compounds during solid-state reactions in the Ni-Bi system | Lee S M.; Chen C.; Kao C.R.; C. ROBERT KAO | Chemistry of Materials | 35 | | |
| 2000 | Formation and resettlement of (AuxNi1-x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish | Ho C.E.; Zheng R.; Luo G.L.; Lin A.H.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 128 | 122 | |
| 2022 | Formation Mechanism of high Ni content (Cu, Ni)6Sn5in Cu/Sn/Ni microbump for solid state aging | Yu, Haiyang; C. ROBERT KAO | Proceedings of 2022 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2022 | 0 | 0 | |
| 2016 | Full intermetallic joints for chip stacking by using thermal gradient bonding | Yang T.L.; Aoki T.; Matsumoto K.; Toriyama K.; Horibe A.; Mori H.; Orii Y.; Wu J.Y.; Kao C.R.; C. ROBERT KAO | Acta Materialia | 68 | 59 | |
| 2009 | Fundamental study of 95 high-lead solder bump on substrates pre-soldered with eutectic PbSn | Chang C.-C.; Lin C.-C.; Kao C.R.; C. ROBERT KAO | IMPACT Conference 2009 International 3D IC Conference | 2 | 0 | |
| 2009 | Fundamental study of the intermixing of 95Pb-5Sn high-lead solder bumps and 37Pb-63Sn pre-solder on chip-carrier substrates | CHIEN-CHENG CHANG ; Lin Y.W.; Lai Y.S.; C. ROBERT KAO | Journal of Electronic Materials | 6 | 5 | |
| 1995 | A generalized quasi-chemical model for ordered multi-component, multi-sublattice intermetallic compounds with anti-structure defects | Chen S.-L.; Kao C.R.; Chang Y.A.; C. ROBERT KAO | Intermetallics | 23 | 26 | |
| 2013 | Gold and palladium embrittlement issues in three-dimensional integrated circuit interconnections | Chen Y.J.; Yang T.L.; Yu J.J.; Kao C.L.; C. ROBERT KAO ; C. ROBERT KAO | Materials Letters | 15 | 14 | |
| 2021 | Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications | Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 1 | 1 | |
| 2017 | Grain Boundary Penetration of Various Types of Ni Layer by Molten Metals | Yang S.; Chang C.Y.; Zhu Z.X.; Lin Y.F.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 0 | 0 | |
| 2010 | Grain growth sequence of Cu3Sn in the Cu/Sn and Cu/Sn-Zn systems | Tsai, M.Y.; Yang, S.C.; Wang, Y.W.; C. ROBERT KAO | Journal of Alloys and Compounds | 24 | 25 |  |
| 2013 | Grain refinement of solder materials by minor element addition | Chung C.K.; Yu J.J.; Yang T.L.; C. ROBERT KAO ; C. ROBERT KAO | International Microsystems, Packaging, Assembly, and Circuits Technology Conference | 5 | 0 | |
| 2014 | Growth kinetics of Ag3Sn in silicon solar cells with a sintered Ag metallization layer | Yang T.L.; Huang K.Y.; Yang S.; Hsieh H.H.; C. ROBERT KAO ; C. ROBERT KAO | Solar Energy Materials and Solar Cells | 31 | 31 | |
